Title:
SOLID-STATE IMAGE CAPTURE DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/026892
Kind Code:
A1
Abstract:
The present technology relates to a solid-state image capture device and an electronic apparatus which make it possible to handle changes in characteristics corresponding to the direction of flow of electric current. Provided is a solid-state image capture device comprising a pixel array unit in which pixels each having a photoelectric conversion portion are two-dimensionally arranged, the pixels having a transistor with a structure in which the amount of overlap under the gate is different between a source-side LDD region and a drain-side LDD region, and in which a junction depth of the source-side LDD region and a junction depth of the drain-side LDD region are different. The present technology may be applied to a CMOS image sensor, for example.
Inventors:
SAKA NAOKI (JP)
Application Number:
PCT/JP2019/028825
Publication Date:
February 06, 2020
Filing Date:
July 23, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/336; H01L29/78; H04N5/369
Foreign References:
| JP2010109138A | 2010-05-13 | |||
| JP2012504332A | 2012-02-16 | |||
| JP2013045878A | 2013-03-04 | |||
| JP2002270825A | 2002-09-20 | |||
| JP2012104664A | 2012-05-31 | |||
| JP2013069913A | 2013-04-18 | |||
| JP2018182709A | 2018-11-15 | |||
| JP2013045878A | 2013-03-04 | |||
| JP2013069913A | 2013-04-18 |
Other References:
See also references of EP 3832727A4
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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