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Patent Searching and Data


Title:
SOLID-STATE IMAGE CAPTURE ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/104177
Kind Code:
A1
Abstract:
The present disclosure relates to a solid-state image capture element enabling a decrease in signal mixing due to electric capacitive coupling with an adjacent pixel, a method for manufacturing the same, and an electronic device. In the solid-state image capture element, a first pixel and a second pixel are disposed adjacent to each other. Each of the first pixel and the second pixel includes a photoelectric conversion film for photoelectric conversion of incident light, and a lower electrode disposed under the film, with another electrode different from the lower electrode provided between the lower electrodes of the first pixel and the second pixel. The present disclosure can be applied, for example, to a solid-state image capture element.

Inventors:
HIRATA SHINTAROU (JP)
YAMAGUCHI TETSUJI (JP)
KOGA FUMIHIKO (JP)
FUKUOKA SHINPEI (JP)
MANDA SHUJI (JP)
Application Number:
PCT/JP2015/084761
Publication Date:
June 30, 2016
Filing Date:
December 11, 2015
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; H01L27/146; H04N5/369
Domestic Patent References:
WO2010116974A12010-10-14
WO2012117670A12012-09-07
Foreign References:
JP2011187544A2011-09-22
JP2004039794A2004-02-05
JPH04348038A1992-12-03
JP2012114160A2012-06-14
US20090115014A12009-05-07
JPH0513748A1993-01-22
JPH03174772A1991-07-29
JP2011109514A2011-06-02
JPH08116045A1996-05-07
JP2015192125A2015-11-02
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
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