Title:
SOLID-STATE IMAGE CAPTURE ELEMENT, IMAGE CAPTURE APPARATUS, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/143554
Kind Code:
A1
Abstract:
The present technology relates to a solid-state image capture element, an image capture apparatus, and an electronic device which enable an increase in focal point accuracy and sensitivity, and suppression of color mixing, in a high image-height portion.
Incident light is condensed by a main lens, and the condensed light is condensed by a plurality of on-chip lenses. The on-chip lenses are shared by a plurality of photodiodes that receive the light condensed by the on-chip lenses and that generate and accumulate charge corresponding to the amount of light, wherein the plurality of photodiodes sharing the on-chip lenses are shaped, in accordance with the image-height of the on-chip lenses, so as to have substantially uniform light reception characteristics. The present technology may be applied to a CMOS image sensor.
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Inventors:
MURASE TAKURO (JP)
NOMURA HIROTOSHI (JP)
NOMURA HIROTOSHI (JP)
Application Number:
PCT/JP2016/055794
Publication Date:
September 15, 2016
Filing Date:
February 26, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; G02B7/34; H01L27/14; H04N5/369; G01C3/06
Foreign References:
| JP2005311469A | 2005-11-04 | |||
| JP2015012127A | 2015-01-19 | |||
| JP2009054806A | 2009-03-12 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
Nishikawa 孝 (JP)
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