Title:
SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/102135
Kind Code:
A1
Abstract:
The present technology relates to a solid-state image pickup device, which is a compound-eye solid-state image pickup device that can pickup images with high qualities irrespective of environments under which the device is used, a method for manufacturing the solid-state image pickup device, and an electronic device.
The solid-state image pickup device is provided with: photoelectric conversion units (21) that are two-dimensionally disposed; on-chip lenses (27a) that are two-dimensionally disposed above the photoelectric conversion units (21), corresponding to the photoelectric conversion units (21), respectively; microlenses (10a) that are disposed by each group of the on-chip lenses (27a) such that the microlenses face the on-chip lenses; and a transparent material layer that is composed of a first intermediate layer (29) and a second intermediate layer (31), which are sandwiched between the on-chip lenses (27a) and the microlenses (10a).
Inventors:
MAEDA KENSAKU (JP)
Application Number:
PCT/JP2012/050837
Publication Date:
August 02, 2012
Filing Date:
January 17, 2012
Export Citation:
Assignee:
SONY CORP (JP)
MAEDA KENSAKU (JP)
MAEDA KENSAKU (JP)
International Classes:
H01L27/14; G02B3/00
Foreign References:
JP2001309395A | 2001-11-02 | |||
JPH06163866A | 1994-06-10 | |||
JP2007184322A | 2007-07-19 | |||
JP2010067624A | 2010-03-25 | |||
JP2002171430A | 2002-06-14 | |||
JP2010067624A | 2010-03-25 |
Attorney, Agent or Firm:
INAMOTO Yoshio et al. (JP)
Yoshio Inemoto (JP)
Yoshio Inemoto (JP)
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Claims: