Title:
SOLID-STATE IMAGE PICKUP ELEMENT AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/047266
Kind Code:
A1
Abstract:
This solid-state image pickup element is provided with: a first electrode and a second electrode; and a photoelectric conversion film, which is formed between the first electrode and the second electrode, and which contains an organic semiconductor and an inorganic material.
Inventors:
NAKAYAMA NORIKAZU (JP)
ONO HIDEKI (JP)
OBANA YOSHIAKI (JP)
MATSUZAWA NOBUYUKI (JP)
ONO HIDEKI (JP)
OBANA YOSHIAKI (JP)
MATSUZAWA NOBUYUKI (JP)
Application Number:
PCT/JP2016/072785
Publication Date:
March 23, 2017
Filing Date:
August 03, 2016
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L27/14; H04N5/369
Domestic Patent References:
| WO2014073446A1 | 2014-05-15 |
Foreign References:
| JP2007157999A | 2007-06-21 | |||
| JP2014220488A | 2014-11-20 | |||
| JP2002100793A | 2002-04-05 | |||
| JP2004165515A | 2004-06-10 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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