Title:
SOLID-STATE IMAGE PICKUP ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/110482
Kind Code:
A1
Abstract:
An imaging device comprising a pixel substrate including pixel element circuitry, a logic substrate including read circuitry configured to receive an output signal voltage from the pixel element circuitry, and electrically-conductive material arranged between the pixel substrate and the logic substrate, wherein the electrically-conductive material is configured to transfer at least one reference voltage from the logic substrate to the pixel substrate, wherein the electrically-conductive material comprises a Cu-Cu bonding portion.
Inventors:
TSUKUDA YASUNORI (JP)
TAKAMIYA KENICHI (JP)
TAKAMIYA KENICHI (JP)
Application Number:
PCT/JP2016/086466
Publication Date:
June 29, 2017
Filing Date:
December 08, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; H04N5/378
Domestic Patent References:
| WO2015050000A1 | 2015-04-09 |
Foreign References:
| US20130092820A1 | 2013-04-18 | |||
| JP2009170448A | 2009-07-30 | |||
| US20140015084A1 | 2014-01-16 | |||
| JP2012244331A | 2012-12-10 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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