Title:
SOLID-STATE IMAGE PICKUP ELEMENT, METHOD FOR DRIVING SOLID-STATE IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/119177
Kind Code:
A1
Abstract:
Disclosed is a solid-state image pickup element that is provided with: a first semiconductor chip having a pixel array unit configured by disposing unit pixels that generate electric signals corresponding to incident light; a second semiconductor chip, which is laminated on the first semiconductor chip, and which has a signal processing unit that performs predetermined signal processing with respect to the electric signals generated by the unit pixels of the pixel array unit; and a signal transmission unit that performs, in a pixel array unit region, electric signal transmission between the first semiconductor chip and the second semiconductor chip in a non-contact manner.
Inventors:
IIDA SATOKO (JP)
Application Number:
PCT/JP2016/082015
Publication Date:
July 13, 2017
Filing Date:
October 28, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; H01L21/822; H01L27/04; H04B5/02; H04N5/3745
Foreign References:
| JP2014027359A | 2014-02-06 | |||
| JP2006049361A | 2006-02-16 | |||
| JP2013090305A | 2013-05-13 | |||
| JP2004015298A | 2004-01-15 |
Attorney, Agent or Firm:
YAMAMOTO Takahisa et al. (JP)
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