Title:
SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/066256
Kind Code:
A1
Abstract:
According to one embodiment of the present invention, a solid-state image pickup element is provided with: a photoelectric conversion layer; an insulating layer, which is provided on one surface of the photoelectric conversion layer, and which has a first opening; and a pair of electrodes that are disposed facing each other by having the photoelectric conversion layer and the insulating layer therebetween. Out of the pair of electrodes, one electrode that is provided on the insulating layer side has a first electrode and a second electrode, which are independent from each other, and the first electrode buries the first opening that is provided in the insulating layer, said first electrode being electrically connected to the photoelectric conversion layer.
Inventors:
KATAOKA TOYOTAKA (JP)
HATANO KEISUKE (JP)
ITO KYOSUKE (JP)
HATANO KEISUKE (JP)
ITO KYOSUKE (JP)
Application Number:
PCT/JP2017/030355
Publication Date:
April 12, 2018
Filing Date:
August 24, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L27/30; H04N5/374
Foreign References:
| US20130093932A1 | 2013-04-18 | |||
| JP2016127264A | 2016-07-11 | |||
| US20130093911A1 | 2013-04-18 | |||
| JP2006120921A | 2006-05-11 | |||
| JP2016201449A | 2016-12-01 | |||
| JP2017143158A | 2017-08-17 | |||
| JP2017157816A | 2017-09-07 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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