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Title:
SOLID STATE IMAGE SENSOR WITH ON-CHIP FILTER AND EXTENDED SPECTRAL RESPONSE
Document Type and Number:
WIPO Patent Application WO/2019/060348
Kind Code:
A3
Abstract:
Various embodiments are directed to an image sensor that includes a first sensor portion and a second sensor portion. The second sensor portion may be positioned relative to the first sensor portion such that the second sensor portion may initially detect light entering the image sensor, and some of that light passes through the second sensor portion and may be detected by the first sensor portion. In some embodiments, one more optical filters may be disposed within the image sensor. The one or more optical filters may include at least one of a dual bandpass filter disposed above the second photodetector or a narrow bandpass filter disposed between the first photodetector and the second photodetector.

Inventors:
HSEIH, Biay-Cheng (5775 Morehouse Drive, San Diego, California, 92121-1714, US)
GEORGIEV, Todor Georgiev (5775 Morehouse Drive, San Diego, California, 92121-1714, US)
MA, Jian (5775 Morehouse Drive, San Diego, California, 92121-1714, US)
GOMA, Sergiu (5775 Morehouse Drive, San Diego, California, 92121-1714, US)
Application Number:
US2018/051640
Publication Date:
June 06, 2019
Filing Date:
September 19, 2018
Export Citation:
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Assignee:
QUALCOMM INCORPORATED (5775 Morehouse Drive, Attn: International IP AdministrationSan Diego, California, 92121-1714, US)
International Classes:
G01J1/16; G01J1/04; G01J3/02; G01J3/36; H01L27/146
Foreign References:
US20150054962A12015-02-26
US20130234029A12013-09-12
US20170179177A12017-06-22
US7646943B12010-01-12
JP2008251985A2008-10-16
Attorney, Agent or Firm:
SOGGU, Pamela (5775 Morehouse Drive, Attn: International IP AdministrationSan Diego, California, 92121-1714, US)
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