Title:
SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/156658
Kind Code:
A1
Abstract:
The present technology pertains to: a solid-state imaging device that can have increased strength in a manner so that it is possible to suppress bending of an imaging element even at a thin substrate suited to a lowered profile of a camera module; a camera module; and an electronic apparatus. A rib that abuts at the edge of the outer peripheral section of an imaging element on a substrate is disposed between passive components or between a passive component and the imaging element at a frame joined to the substrate, at which is mounted the imaging element and the passive component. Also, a frame component is pasted onto the substrate by means of adhering the rib of the frame component and an abutment position on the substrate by means of an adhesive. The present invention can be applied to a camera module.
Inventors:
DOBASHI EIICHIRO (JP)
Application Number:
PCT/JP2014/056523
Publication Date:
October 02, 2014
Filing Date:
March 12, 2014
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H04N5/225; G03B17/02
Foreign References:
| JP2007221332A | 2007-08-30 | |||
| JP2007300488A | 2007-11-15 | |||
| JP2011086670A | 2011-04-28 | |||
| JP2005328364A | 2005-11-24 | |||
| JP2008235869A | 2008-10-02 | |||
| JP2011147091A | 2011-07-28 | |||
| JP2011101385A | 2011-05-19 |
Attorney, Agent or Firm:
INAMOTO Yoshio et al. (JP)
Yoshio Inemoto (JP)
Yoshio Inemoto (JP)
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