Title:
SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/186194
Kind Code:
A1
Abstract:
[Problem] To provide a solid state imaging device and an electronic apparatus that have improved performance. [Solution] A solid state imaging device that is formed by laminating, in order, a first substrate, a second substrate, and a third substrate. The first substrate is formed by laminating a first semiconductor substrate and a first multilayer wiring layer and has formed thereon a pixel unit that comprises an array of pixels. The second substrate is formed by laminating a second semiconductor substrate and a second multilayer wiring layer and has formed thereon a circuit that has a prescribed function. The third substrate is formed by laminating a third semiconductor substrate and a third multilayer wiring layer and has formed thereon a circuit that has a prescribed function. The first substrate and the second substrate are adhered to each other such that the first multilayer wiring layer and the second semiconductor substrate face. A first connection structure that is for electrically connecting a circuit on the first substrate and the circuit on the second substrate includes a via that is structured such that a conductive material is embedded or formed as a film in: a first through hole that exposes wiring that is in the first multilayer wiring layer; and a second through hole that is different from the first through hole and exposes wiring that is in the second multilayer wiring layer.
More Like This:
WO/1983/002038 | SEMICONDUCTOR PHOTOELECTRIC CONVERTER |
WO/2022/199952 | IMAGE SENSOR ASSEMBLY, SOLID-STATE IMAGING DEVICE AND TIME-OF-FLIGHT SENSOR ASSEMBLY |
WO/2020/032924 | ADAPTIVE COMPTON CAMERA FOR MEDICAL IMAGING |
Inventors:
HASHIGUCHI HIDETO (JP)
SHOHJI REIJIROH (JP)
HORIKOSHI HIROSHI (JP)
MITSUHASHI IKUE (JP)
IIJIMA TADASHI (JP)
KAMESHIMA TAKATOSHI (JP)
ISHIDA MINORU (JP)
HANEDA MASAKI (JP)
SHOHJI REIJIROH (JP)
HORIKOSHI HIROSHI (JP)
MITSUHASHI IKUE (JP)
IIJIMA TADASHI (JP)
KAMESHIMA TAKATOSHI (JP)
ISHIDA MINORU (JP)
HANEDA MASAKI (JP)
Application Number:
PCT/JP2018/011567
Publication Date:
October 11, 2018
Filing Date:
March 23, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18; H04N5/369
Foreign References:
JP2014099582A | 2014-05-29 | |||
JP2016171297A | 2016-09-23 | |||
JP2015135938A | 2015-07-27 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
Download PDF:
Previous Patent: SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Next Patent: SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC INSTRUMENT
Next Patent: SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC INSTRUMENT