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Patent Searching and Data


Title:
SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/186194
Kind Code:
A1
Abstract:
[Problem] To provide a solid state imaging device and an electronic apparatus that have improved performance. [Solution] A solid state imaging device that is formed by laminating, in order, a first substrate, a second substrate, and a third substrate. The first substrate is formed by laminating a first semiconductor substrate and a first multilayer wiring layer and has formed thereon a pixel unit that comprises an array of pixels. The second substrate is formed by laminating a second semiconductor substrate and a second multilayer wiring layer and has formed thereon a circuit that has a prescribed function. The third substrate is formed by laminating a third semiconductor substrate and a third multilayer wiring layer and has formed thereon a circuit that has a prescribed function. The first substrate and the second substrate are adhered to each other such that the first multilayer wiring layer and the second semiconductor substrate face. A first connection structure that is for electrically connecting a circuit on the first substrate and the circuit on the second substrate includes a via that is structured such that a conductive material is embedded or formed as a film in: a first through hole that exposes wiring that is in the first multilayer wiring layer; and a second through hole that is different from the first through hole and exposes wiring that is in the second multilayer wiring layer.

Inventors:
HASHIGUCHI HIDETO (JP)
SHOHJI REIJIROH (JP)
HORIKOSHI HIROSHI (JP)
MITSUHASHI IKUE (JP)
IIJIMA TADASHI (JP)
KAMESHIMA TAKATOSHI (JP)
ISHIDA MINORU (JP)
HANEDA MASAKI (JP)
Application Number:
PCT/JP2018/011567
Publication Date:
October 11, 2018
Filing Date:
March 23, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18; H04N5/369
Foreign References:
JP2014099582A2014-05-29
JP2016171297A2016-09-23
JP2015135938A2015-07-27
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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