Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/085091
Kind Code:
A1
Abstract:
The present invention improves photoelectric conversion efficiency. A solid-state imaging device according to an embodiment is provided with: a photoelectric conversion part (PD) provided on a semiconductor substrate; a first insulating film (135) located on the light incident surface side of the photoelectric conversion part with respect to the semiconductor substrate; and a structure having recesses and protrusions (150) located between the photoelectric conversion part and the first insulating film. The structure having recesses and protrusions is provided with a first layer (151) that is located on the photoelectric conversion part side and diffracts light incident on the photoelectric conversion part, and a second layer (152) that is located on the first insulating film side and suppresses reflection to the first insulating film side.
Inventors:
TAKEUCHI KOICHI (JP)
Application Number:
PCT/JP2020/038367
Publication Date:
May 06, 2021
Filing Date:
October 09, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B5/20; H04N5/369
Domestic Patent References:
| WO2016194654A1 | 2016-12-08 |
Foreign References:
| JP2019046960A | 2019-03-22 | |||
| JP2018088532A | 2018-06-07 | |||
| JP2012174885A | 2012-09-10 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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