Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/100447
Kind Code:
A1
Abstract:
Provided is a solid-state imaging device with which it is possible to further improve image quality and function. Provided is a solid-state imaging device including a pixel region in which a plurality of pixels are arranged two-dimensionally. The pixels have: a photoelectric conversion unit for photoelectrically converting incident light, the photoelectric conversion unit being formed on a semiconductor substrate; and a concave-convex part formed in a region above the photoelectric conversion unit and on the light reception surface-side of the semiconductor substrate. The number of concave-convex features on the concave-convex part of the pixels positioned at the center part of the pixel region and the number of concave-convex features on the concave-convex part of the pixels positioned at the peripheral part of the pixel region are different.
Inventors:
KOBAYASHI YASUFUMI (JP)
MURASE TAKURO (JP)
MURASE TAKURO (JP)
Application Number:
PCT/JP2020/041009
Publication Date:
May 27, 2021
Filing Date:
November 02, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
WO2016047282A1 | 2016-03-31 |
Foreign References:
US20180182806A1 | 2018-06-28 | |||
JP2017108062A | 2017-06-15 | |||
JP2013033864A | 2013-02-14 | |||
US20180277581A1 | 2018-09-27 | |||
JP2006100515A | 2006-04-13 | |||
JP2020174158A | 2020-10-22 | |||
JP2020155514A | 2020-09-24 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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