Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/097445
Kind Code:
A1
Abstract:
[Problem] To suppress image quality degradation in a captured image. [Solution] This solid-state imaging device comprises a plurality of first semiconductor chips that each perform A/D conversion of a plurality of imaging signals. Each of the plurality of first semiconductor chips includes: a reference signal line that conveys a reference signal for the A/D conversion; a reference signal generation unit that generates the reference signal; and a plurality of analog to digital converters (ADCs) that convert the plurality of imaging signals to a plurality of digital signals on the basis of comparison between the plurality of imaging signals and the reference signal. The plurality of reference signal lines in the plurality of first semiconductor chips are electrically connected to one another. The reference signal generated by the reference signal generation unit in one of the plurality of first semiconductor chips is supplied to the plurality of reference signal lines.
Inventors:
ASAKURA LUONGHUNG (JP)
Application Number:
PCT/JP2021/038104
Publication Date:
May 12, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/378
Domestic Patent References:
| WO2020153123A1 | 2020-07-30 | |||
| WO2015079597A1 | 2015-06-04 |
Foreign References:
| JP2015177311A | 2015-10-05 | |||
| JP2007019682A | 2007-01-25 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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