Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2022/176626
Kind Code:
A1
Abstract:
The present invention suppresses a signal range, in which it is possible to detect the phase difference, from being narrowed. A solid-state imaging device according to the present invention comprises a semiconductor layer having one surface serving as a light incident surface and another surface serving as an element forming surface. The semiconductor layer has a plurality of photoelectric conversion units comprising: a first photoelectric conversion part; a second photoelectric conversion part; a separation part that is provided between the first photoelectric conversion part and the second photoelectric conversion part and enables formation of a first potential barrier; a charge accumulation region; a first transmission transistor that transmits a signal charge from the first photoelectric conversion part to the charge accumulation region, and enables, when not transmitting, formation of a second potential barrier which is higher than the first potential barrier; and a second transmission transistor that transmits a signal charge from the second photoelectric conversion part to the charge accumulation region, and enables, when not transmitting, formation of the second potential barrier. The separation part includes: a first region that is formed of an insulating material and extends in the thickness direction of the semiconductor layer from the element forming surface side; and a second region that is provided on the light incident surface side of the first region and comprises a first conductivity-type semiconductor region, which is injected with an impurity.
Inventors:
TOJINBARA HIROKI (JP)
Application Number:
PCT/JP2022/004144
Publication Date:
August 25, 2022
Filing Date:
February 03, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
| WO2020013130A1 | 2020-01-16 | |||
| WO2017130723A1 | 2017-08-03 |
Foreign References:
| JP2013084742A | 2013-05-09 | |||
| US20170104020A1 | 2017-04-13 | |||
| JP2002165126A | 2002-06-07 | |||
| JP2018142739A | 2018-09-13 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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