Title:
SOLID-STATE IMAGING DEVICE AND INFORMATION PROCESSING METHOD OF SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/135142
Kind Code:
A1
Abstract:
A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.
Inventors:
MINAGAWA YUSUKE (JP)
YOSHIDA TAISHIN (JP)
TOYOSHIMA MARIE (JP)
AKISHITA TORU (JP)
MORIMOTO TOMOHIRO (JP)
KUSAKAWA MASAFUMI (JP)
TAMURA IKUHIRO (JP)
AKAHANE TAKAHIRO (JP)
HIRATA EIJI (JP)
FURUSAWA YOSHINOBU (JP)
YOSHIDA TAISHIN (JP)
TOYOSHIMA MARIE (JP)
AKISHITA TORU (JP)
MORIMOTO TOMOHIRO (JP)
KUSAKAWA MASAFUMI (JP)
TAMURA IKUHIRO (JP)
AKAHANE TAKAHIRO (JP)
HIRATA EIJI (JP)
FURUSAWA YOSHINOBU (JP)
Application Number:
PCT/JP2017/042846
Publication Date:
July 26, 2018
Filing Date:
November 29, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/335
Foreign References:
| US20150089241A1 | 2015-03-26 | |||
| EP1608101A1 | 2005-12-21 | |||
| US20120153419A1 | 2012-06-21 | |||
| JP2004173154A | 2004-06-17 |
Attorney, Agent or Firm:
KAMEYA, Yoshiaki et al. (JP)
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