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Patent Searching and Data


Title:
SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/087918
Kind Code:
A1
Abstract:
This solid-state imaging device comprises a multiple overlapping substrates, each of which comprises a semiconductor layer on which a photoelectric conversion unit is formed that converts incident light into a signal, and a wiring layer which overlaps with the semiconductor layer and has wiring formed therein for transmitting the aforementioned signal. The semiconductor layer of a first of two adjacent substrates of the multiple substrates and the wiring layer of the second substrate of the two adjacent substrates face one another, and a connection structure is included which electrically connects the semiconductor layer of the first substrate and the wiring layer of the second substrate and which passes through only the semiconductor layer of the first substrate and not the wiring layer of the second substrate.

Inventors:
GOMI YUICHI (JP)
Application Number:
PCT/JP2014/082696
Publication Date:
June 18, 2015
Filing Date:
December 10, 2014
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L27/14; H01L25/065; H01L25/07; H01L25/18; H01L27/146; H04N5/369
Domestic Patent References:
WO2011148445A12011-12-01
WO2007105478A12007-09-20
Foreign References:
JP2013187475A2013-09-19
JP2001339057A2001-12-07
JPH05267394A1993-10-15
JP2011530165A2011-12-15
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
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