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Title:
SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS HAVING SOLID-STATE IMAGING DEVICE MOUNTED THERETO
Document Type and Number:
WIPO Patent Application WO/2019/188026
Kind Code:
A1
Abstract:
Provided are a solid-state imaging device, a solid-state imaging device manufacturing method, and an electronic apparatus having the solid-state imaging device mounted thereto that enable miniaturization of a semiconductor chip by having two sensors controlled by a single semiconductor substrate having a logical circuit. Provided is a solid-state imaging device comprising a first sensor, a first semiconductor substrate having a memory, a second semiconductor substrate having a logical circuit, and a second sensor, wherein the first sensor, the first semiconductor substrate, the second semiconductor substrate, and the second sensor are disposed in this order.

Inventors:
NISHIZAWA Kenichi (4-14-1 Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
JP2019/008487
Publication Date:
October 03, 2019
Filing Date:
March 05, 2019
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi Kanagawa, 14, 〒2430014, JP)
International Classes:
H01L27/146; H01L21/3205; H01L21/768; H01L23/522; H01L23/532; H01L25/065; H01L25/07; H01L25/18; H01L27/00; H04N5/335; H04N5/369
Domestic Patent References:
WO2006129762A12006-12-07
Foreign References:
US20140138520A12014-05-22
JP2014099582A2014-05-29
JP2004335533A2004-11-25
JP2018117027A2018-07-26
Attorney, Agent or Firm:
WATANABE Kaoru (KUNPU INTELLECTUAL PROPERTY AGENTS, SUCCESS-SENGAKUJI BLDG. 3F 2-20-29, Takanawa, Minato-k, Tokyo 74, 〒1080074, JP)
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