SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2015/001987

A1

　The present disclosure relates to a solid-state imaging device in which sensitivity can be improved while suppressing color mixing degradation, a method for manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device is provided with: anti-reflection parts having a moth-eye structure, the anti-reflection parts being provided to a light-receiving-surface-side interface of a photoelectric conversion region of each two-dimensionally arranged pixel; and inter-pixel light-shielding parts for blocking incident light, the inter-pixel light-shielding parts being provided at or below the interface of the anti-reflection parts. The photoelectric conversion region is a semiconductor region, and each of the inter-pixel light-shielding parts has a trench structure in which the semiconductor region at the pixel boundary is dug inwards in the depth direction. The technique of the present disclosure can be applied, e.g., to a reverse surface emission-type solid-state imaging device.

MASUDA YOSHIAKI (JP)
MIYANAMI YUKI (JP)
ABE HIDESHI (JP)
HIRANO TOMOYUKI (JP)
YAMAGUCHI MASANARI (JP)
EBIKO YOSHIKI (JP)
WATANABE KAZUFUMI (JP)
OGITA TOMOHARU (JP)

PCT/JP2014/066400

January 08, 2015

June 20, 2014

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SONY CORP (JP)

H01L27/14; G02B1/11; H01L27/146; H01L31/10; H04N5/359; H04N5/374; H04N9/04

WO2012117931A1

2012-09-07

JP2013033864A	2013-02-14
JP2012178457A	2012-09-13
JP2012169530A	2012-09-06

NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)

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