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Title:
SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SAME AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/159766
Kind Code:
A1
Abstract:
The present disclosure relates to: a solid-state imaging device wherein utilization efficiency of a substrate is able to be increased; a method for manufacturing this solid-state imaging device; and an electronic device. This solid-state imaging device is provided with: a first semiconductor substrate which has a sensor circuit comprising a photoelectric conversion part; and a second semiconductor substrate and a third semiconductor substrate, each of which has a circuit that is different from the sensor circuit. The first semiconductor substrate, the second semiconductor substrate and the third semiconductor substrate are laminated such that the first semiconductor substrate serves as the uppermost layer, and a metal element for electrodes, which constitutes an electrode for external connection, is arranged on the first semiconductor substrate. In addition, a metal element for electrodes, which constitutes an electrode for measurement terminals, is arranged in the second semiconductor substrate or in the third semiconductor substrate, and after performing a predetermined measurement, the first semiconductor substrate is laminated thereon, thereby constituting the solid-state imaging device. The present technique is applicable, for example, to a backside-illuminated solid-state imaging element.

Inventors:
TAKAHASHI HIROSHI (JP)
Application Number:
PCT/JP2015/060924
Publication Date:
October 22, 2015
Filing Date:
April 08, 2015
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; H01L21/3205; H01L21/66; H01L21/768; H01L23/522; H01L27/00; H01L27/146; H04N5/369
Domestic Patent References:
WO2001063661A12001-08-30
Foreign References:
JP2013219319A2013-10-24
JP2004281633A2004-10-07
JPH06244235A1994-09-02
JP2013201188A2013-10-03
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
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