Title:
SOLID-STATE IMAGING DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/124085
Kind Code:
A1
Abstract:
This technology relates to: a solid-state imaging device which is capable of suppressing the occurrence of a bonding failure when configured by bonding two substrates; and a method for producing this solid-state imaging device. Provided is a solid-state imaging device which is provided with: a first substrate which has a first electrode that is formed from a metal; and a second substrate which is to be bonded to the first substrate and has a second electrode that is to be joined with the first electrode, while being formed from a metal. At least one of the first substrate and the second substrate is provided with a metal diffusion prevention layer for a layer that has a hole in which a metal for forming the electrode is embedded. This technology is able to be applied, for example, to solid-state imaging devices such as CMOS image sensors.
Inventors:
FUKASAWA MASANAGA (JP)
Application Number:
PCT/JP2018/044825
Publication Date:
June 27, 2019
Filing Date:
December 06, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/768; H01L27/146; H04N5/374; H04N5/378
Foreign References:
| JP2013033900A | 2013-02-14 | |||
| JP2003124311A | 2003-04-25 | |||
| JP2000332107A | 2000-11-30 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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