SOLID-STATE IMAGING DEVICE AND METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE

WIPO Patent Application WO/2020/122032

A1

The present invention provides a solid-state imaging device, as well as a method for producing the same, which features improved light-collection efficiency even for smaller pixels and has high resolution and good sensitivity for all colors. The solid-state imaging device comprises: a semiconductor substrate; a plurality of photoelectric transducers provided on the semiconductor substrate and arranged in a matrix in plan view; a color filter layer in which multiple colors of color filters arranged corresponding to each of the plurality of photoelectric transducers are two-dimensionally arranged in a regular pattern set in advance; and microlenses formed from a plurality of stacked microlens layers each including multiple lenses arranged corresponding to each of the multiple colors of color filters and each of the plurality of photoelectric transducers. The film thickness of a first microlens layer closest to the photoelectric transducers among the plurality of microlens layers is between 150 nm and 400 nm, inclusive.

TAKAHASHI SATOSHI (JP)
HARA TAKAHIRO (JP)
IMOTO TOMOHIRO (JP)

PCT/JP2019/048162

June 18, 2020

December 09, 2019

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TOPPAN PRINTING CO LTD (JP)

G02B3/00; H01L27/146

WO2013179972A1

2013-12-05

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HIROSE Hajime et al. (JP)

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