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Patent Searching and Data


Title:
SOLID STATE IMAGING DEVICE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/092731
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solid state imaging device and a production method therefor, said solid state imaging device: being capable of high-precision detection of images in a thin specimen or an inclined specimen; and easily suppressing the effect of variation in specimen thickness. The solid state imaging device comprises: a transparent substrate (1) having a first surface upon which an imaging target is to be mounted; a solid state imaging element (5) arranged facing the first surface and having, on the surface thereof facing the first surface, an imaging unit (4) and a first electrode (3) connected to the imaging unit (4); and a flexible wiring substrate (7) arranged around a position at which the imaging target is to be mounted. The flexible wiring substrate (7) has an insulating layer (7B) and a wiring layer (7A). The wiring in the wiring layer (7A) has a wiring section jutting out from the insulating layer (7B). A second electrode (6) is formed in the jutting out wiring section and the first electrode (3) is electrically connected to the second electrode (6).

Inventors:
KAWABATA TAKESHI
NAKAMURA YOSHIFUMI
YOKOYAMA KENJI
Application Number:
PCT/JP2015/005315
Publication Date:
June 16, 2016
Filing Date:
October 22, 2015
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L27/14; G01N21/17; G02B6/12; H04N5/225; H04N5/369; H05K1/18
Foreign References:
JP2007134549A2007-05-31
JP2013509618A2013-03-14
JP2007163453A2007-06-28
JP2005227155A2005-08-25
JP2011242280A2011-12-01
JP2008233080A2008-10-02
Attorney, Agent or Firm:
FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)
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