Title:
SOLID STATE IMAGING DEVICE AND SOLID STATE IMAGING DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/111373
Kind Code:
A1
Abstract:
A solid state imaging device comprising a semiconductor substrate having an input surface on which light falls incident and an element-forming surface on the opposite side from the input surface, the semiconductor substrate having a plurality of photoelectric conversion elements which are formed as a two-dimensional array on the element-forming surface and generate signal charges in response to the amount of incident light, a first light-blocking separation layer formed at positions in between the plurality of photoelectric conversion elements as grooves with depths penetrating to the input surface from the element-forming surface, and a second light-blocking separation layer formed at positions in between the plurality of photoelectric conversion elements as grooves with depths within a range from the input surface of the semiconductor substrate to the element-forming surface, wherein the first light-blocking separation layer is formed such that each groove has a taper shape that is wide on the element-forming surface side and narrow on the input surface side, and the second light-blocking separation layer is formed such that each groove has a taper shape that is wide on the input surface side and narrow on the element-forming surface side.
Inventors:
KONDO TORU (JP)
Application Number:
PCT/JP2017/043986
Publication Date:
June 13, 2019
Filing Date:
December 07, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L27/146; H04N5/369; H04N5/378
Domestic Patent References:
| WO2016052219A1 | 2016-04-07 |
Foreign References:
| US20160204150A1 | 2016-07-14 | |||
| US20160099267A1 | 2016-04-07 | |||
| JP2011114325A | 2011-06-09 | |||
| JP2009088140A | 2009-04-23 | |||
| US20140327051A1 | 2014-11-06 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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