Title:
SOLID-STATE IMAGING DEVICE, SHAPE-MEASURING DEVICE, AND SHAPE-MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/119816
Kind Code:
A1
Abstract:
A solid-state imaging device 5A comprises: a first light reception unit 10; and second light reception units 20A, 20B. In the first light reception unit 10, a plurality of pixel pairs 11 are arranged in the x-direction. In each of the second light reception units 20A, 20B, a plurality of pixels 21, which each generate electric charges in an amount in accordance with the amount of received light, are arranged in the y-direction. Each of the pixel pairs 11 includes a first pixel 12 and a second pixel 13. When linear light extending in the x-direction enters the first light reception unit 10, as the entering location of the light is shifted from one side toward the other side in the y-direction, the amount of electric charges generated by the first pixels 12 gradually decreases and the amount of electric charges generated by the second pixels 13 gradually increases. As a result, a solid-state imaging device capable of assessing and adjusting an optical setting state when used in shape measurement using a light sectioning method.
Inventors:
TAKUMI MUNENORI (JP)
UCHIDA KEISUKE (JP)
UCHIDA KEISUKE (JP)
Application Number:
PCT/JP2022/038601
Publication Date:
June 29, 2023
Filing Date:
October 17, 2022
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01B11/24
Domestic Patent References:
| WO2019059236A1 | 2019-03-28 |
Foreign References:
| US5567976A | 1996-10-22 | |||
| JPS61140827A | 1986-06-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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