Title:
SOLID-STATE IMAGING DEVICE, SIGNAL PROCESSING METHOD THEREOF, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/079331
Kind Code:
A1
Abstract:
The present technology relates to: a solid-state imaging device which is capable of coping with an arbitrary change in an imaging process of a pixel array unit; a signal processing method thereof; and an electronic device. The solid-state imaging device is provided with: a pixel array unit in which a plurality of pixels are arrayed in a two-dimensional array shape; an analog-to-digital (AD) conversion unit which AD-converts a pixel signal output from a pixel of the pixel array unit; a memory which holds the digital pixel signal obtained after the AD conversion; and an image signal processing circuit which performs a prescribed signal processing on the digital pixel signal. The image signal processing circuit is provided with: one or more processing elements (PEs) which execute a prescribed calculation process; two or more processing units (PUs), each of which is formed of a control unit (CU) which operates the PEs in an SIMD format, an IMEM which stores one or more calculation processing commands; and a CCU which controls the PUs. The present technology can be applied to, for example, a solid-state imaging device or the like that allows a plurality of regions of a pixel array unit to be processed differently.
Inventors:
SHIDA SAYAKA (JP)
Application Number:
PCT/JP2017/037476
Publication Date:
May 03, 2018
Filing Date:
October 17, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/378; G06T1/20; H01L27/146; H04N5/341; H04N5/374
Domestic Patent References:
| WO2006123822A1 | 2006-11-23 | |||
| WO2014007004A1 | 2014-01-09 |
Foreign References:
| JP2002094886A | 2002-03-29 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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