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Title:
SOLID-STATE IMAGING DEVICE, IMAGING DEVICE, AND IMAGING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/140920
Kind Code:
A1
Abstract:
The present invention inhibits a deterioration in image quality. A solid-state imaging device (1) according to an embodiment comprises a photoelectric conversion part (PD) configured by using a material having a smaller band gap energy than silicon, and a circuit board (200) joined to the photoelectric conversion part, wherein the circuit board comprises: a pixel signal generation circuit (45) that generates a pixel signal of a voltage value in accordance with a charge generated in the photoelectric conversion part; and a thermometer circuit (120) that detects the temperature of the circuit board.

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Inventors:
SUZUKI MISAO (JP)
TSUJI KIYOSHIGE (JP)
Application Number:
PCT/JP2020/048291
Publication Date:
July 15, 2021
Filing Date:
December 23, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01J1/02; G01J1/44; H01L21/822; H01L23/02; H01L27/04; H01L27/146; H01L35/32; H04N5/33
Domestic Patent References:
WO2018194030A12018-10-25
WO2013084529A12013-06-13
Foreign References:
JP2017092781A2017-05-25
JP2015005533A2015-01-08
JP2008236158A2008-10-02
JP2018182020A2018-11-15
JP2013232529A2013-11-14
JP2014241376A2014-12-25
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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