Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/199840
Kind Code:
A1
Abstract:
This solid-state imaging device (1A) is provided with a sensor-panel unit (10) and a readout-circuit unit (40). The sensor-panel unit (10) is provided on a glass substrate (12) and has the following: a light-receiving section (20) containing pixels (P1,1 through PM,N) arrayed in M rows and N columns; row-selection wires (Q1 through QM); and readout wires (R1 through RN). The readout-circuit unit (40) is provided on another substrate (41) and has N integrating circuits (42). Rectifying circuits (72) are connected between a fixed-potential line (71) and nodes (N1 through NN) between the integrating circuits (42) and N panel-side connection points (13), and circuit structures (73) having resistive components are connected between the aforementioned nodes (N1 through NN) and the abovementioned readout wires (R1 through RN). As a result, even if a short-circuit occurs between a row-selection wire and the readout wire in a given column, abnormalities in the output voltages from the integrating circuits in the other columns can be prevented.
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Inventors:
FUJITA KAZUKI (JP)
KYUSHIMA RYUJI (JP)
MORI HARUMICHI (JP)
KYUSHIMA RYUJI (JP)
MORI HARUMICHI (JP)
Application Number:
PCT/JP2014/064333
Publication Date:
December 18, 2014
Filing Date:
May 29, 2014
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H04N5/367; H01L27/144; H01L27/146; H04N5/32; H04N5/374
Foreign References:
| US6407770B1 | 2002-06-18 | |||
| US20020164861A1 | 2002-11-07 | |||
| JP2009089078A | 2009-04-23 | |||
| JP2000046645A | 2000-02-18 | |||
| JP2009089078A | 2009-04-23 | |||
| JP2009302092A | 2009-12-24 |
Other References:
See also references of EP 3010228A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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