Title:
SOLID-STATE IMAGING ELEMENT AND IMAGING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/094362
Kind Code:
A1
Abstract:
According to the present invention, detection efficiency is improved in a solid-state imaging element having a SPAD in which an electrode or a wiring is placed on a center part. A solid-state imaging element according to the present invention is provided with a photodiode and a light condensing part. The photodiode has a light receiving surface and an electrode placed on the light receiving surface, and outputs an electric signal in accordance with light incident on the light receiving surface when a voltage exceeding a breakdown voltage is applied to the electrode. The light condensing part condenses light from an object on the light receiving surface of the photodiode, except for the area where the electrode is placed.
Inventors:
YORIKADO YUHI (JP)
TODA ATSUSHI (JP)
INOUE SUSUMU (JP)
TODA ATSUSHI (JP)
INOUE SUSUMU (JP)
Application Number:
PCT/JP2016/080501
Publication Date:
June 08, 2017
Filing Date:
October 14, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; G02B3/00; H01L27/14; H01L31/0232; H01L31/107; H04N5/357; H04N5/369; H04N5/374
Foreign References:
| JP2011159972A | 2011-08-18 | |||
| JPH07161953A | 1995-06-23 | |||
| JPH0964324A | 1997-03-07 | |||
| JP2015167219A | 2015-09-24 | |||
| JP2013143431A | 2013-07-22 |
Other References:
See also references of EP 3385987A4
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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