Title:
SOLID-STATE IMAGING ELEMENT, IMAGING APPARATUS, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/007797
Kind Code:
A1
Abstract:
The present disclosure relates to a solid-state imaging element, an imaging apparatus and an electronic device wherein the influence caused by forming a PAD electrode can be reduced. When a logic board that is smaller than an image sensor is laminated, a via hole is formed in the image sensor in such a manner that a PAD electrode is formed in an embedded member that is embedded around the logic board. The present disclosure can be applied to imaging apparatuses.
Inventors:
YAMADA KYOSUKE (JP)
Application Number:
PCT/JP2022/008491
Publication Date:
February 02, 2023
Filing Date:
March 01, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2019087764A1 | 2019-05-09 | |||
| WO2019017147A1 | 2019-01-24 | |||
| WO2020184027A1 | 2020-09-17 | |||
| WO2014083750A1 | 2014-06-05 |
Foreign References:
| JP2021089979A | 2021-06-10 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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