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Title:
SOLID STATE IMAGING ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/155709
Kind Code:
A1
Abstract:
The objective of the invention is to suppress ripples in a solid state imaging element for determining an optical spectrum. This solid state imaging element comprises a surface layer, a filter layer, and a photoelectric conversion layer. In this solid state imaging element, the thickness of the surface layer exceeds half of the coherence length of incoming light. Further, in this solid state imaging element, of the incident light that has been transmitted through the surface layer, the filter layer transmits predetermined light of interest and reflects the remainder toward the surface layer. In addition, in this solid state imaging element, the photoelectric conversion layer performs photoelectric conversion of the predetermined light of interest that has been transmitted through the filter layer.

Inventors:
TODA ATSUSHI (JP)
Application Number:
PCT/JP2018/042049
Publication Date:
August 15, 2019
Filing Date:
November 14, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B1/11; G02B5/26; G06V10/143; G06V10/147; H04N5/369; H04N9/07
Domestic Patent References:
WO2016056396A12016-04-14
WO2016009925A12016-01-21
Foreign References:
JP2008177362A2008-07-31
JP2010519825A2010-06-03
JP2013191717A2013-09-26
JP2012023251A2012-02-02
JP2005252183A2005-09-15
JP2010267086A2010-11-25
JP2010109137A2010-05-13
JP2008300788A2008-12-11
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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