Title:
SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/026636
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solid-state imaging element with which it is possible to further improve reliability. Provided is a solid-state imaging element that, in order from the light entry side, is equipped with at least with a first photoelectric conversion unit and a semiconductor substrate in which a second photoelectric conversion part is formed. The first photoelectric conversion part includes at least, a first electrode, a photoelectric conversion layer, a first oxide semiconductor layer, a second oxide semiconductor layer, and a second electrode, in the stated order. The film density of the first oxide semiconductor layer is higher than the film density of the second oxide semiconductor layer.
Inventors:
HAYASHI TOSHIHIKO (JP)
JOEI MASAHIRO (JP)
MURATA KENICHI (JP)
HIRATA SHINTAROU (JP)
JOEI MASAHIRO (JP)
MURATA KENICHI (JP)
HIRATA SHINTAROU (JP)
Application Number:
PCT/JP2019/024472
Publication Date:
February 06, 2020
Filing Date:
June 20, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L27/30; H01L31/10; H04N5/369
Domestic Patent References:
| WO2016009693A1 | 2016-01-21 |
Foreign References:
| JP2018085402A | 2018-05-31 | |||
| JP2017034039A | 2017-02-09 | |||
| JP2017017324A | 2017-01-19 | |||
| JP2014199913A | 2014-10-23 | |||
| JP2016154229A | 2016-08-25 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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