Title:
SOLID-STATE IMAGING ELEMENT, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/069733
Kind Code:
A1
Abstract:
The present disclosure pertains to a solid-state imaging element, a manufacturing method, and an electronic apparatus, by which adverse effects of high-order light from diffracted light on the quality of an image can be suppressed. A glass plate material is bonded to a semiconductor substrate having formed thereon a pixel region where a plurality of pixels are arranged, so as to inhibit occurrence of a gap between the glass plate material and the pixel region. A low refractive index layer having a refractive index lower than that of the glass substrate, is disposed on a resin layer between the glass plate material and a low reflection film formed on a surface of an on-chip lens disposed for each pixel. The low refractive index layer is formed of a hole layer made of a plurality of micropores each having a diameter smaller than the pixel pitch, and a film formed so as to close the plurality of micropores so as to be hollow. The present technology is applicable, for example, to an imaging element chip having a non-cavity structure.
Inventors:
OOKI SUSUMU (JP)
Application Number:
PCT/JP2018/035262
Publication Date:
April 11, 2019
Filing Date:
September 25, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B1/118; G02B3/00; H04N5/357; H04N5/369
Domestic Patent References:
| WO2017094537A1 | 2017-06-08 |
Foreign References:
| JP2010040621A | 2010-02-18 | |||
| JP2016001681A | 2016-01-07 | |||
| JPH0722599A | 1995-01-24 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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