Title:
SOLID-STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/045933
Kind Code:
A1
Abstract:
The present disclosure relates to a solid-state imaging element in which the cost reduction of a curved imaging element can be achieved, a method for manufacturing the solid-state imaging element, and an electronic device. A curved base is formed so as to be curved in a recessed shape at the center, leaving a small edge. The curved base is divided into five portions including an element arrangement portion and four peripheral portions. The element arrangement portion is formed in a porous state. A pore (air cell) in the porous element arrangement portion is smaller than the pixel size. A porous material made, for example, from ceramic, metal, or resin, can be used as the porous material. The present disclosure is applicable to, for example, CMOS solid-state imaging elements used in imaging devices.
Inventors:
YAMAMOTO YUICHI (JP)
NAGAOKA KOJIRO (JP)
NAGAOKA KOJIRO (JP)
Application Number:
PCT/JP2014/074363
Publication Date:
April 02, 2015
Filing Date:
September 16, 2014
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; H04N5/369
Foreign References:
| JP2012249003A | 2012-12-13 | |||
| JP2004253509A | 2004-09-09 | |||
| JP2004119672A | 2004-04-15 | |||
| JP2005209805A | 2005-08-04 | |||
| JP2005260043A | 2005-09-22 | |||
| JP2005191218A | 2005-07-14 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
Nishikawa 孝 (JP)
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