Title:
SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/220861
Kind Code:
A1
Abstract:
This solid-state imaging element comprises: a plurality of pixels that each have a photoelectric conversion element and are arranged along a first direction and a second direction intersecting the first direction; and microlenses that include lens parts that are respectively provided on the light entry sides of the photoelectric conversion elements of the pixels, have lens shapes, and are in contact with each other between pixels that are adjacent to each other in the first direction and second direction, and an inorganic film covering the lens parts. The microlenses have first recessed parts that are provided between pixels that are adjacent to each other in the first direction and second direction and second recessed parts that are provided between pixels that are adjacent to each other in a third direction intersecting the first direction and second direction and are disposed at positions closer to the photoelectric conversion elements than the first recessed parts.
Inventors:
OOTSUKA YOICHI (JP)
Application Number:
PCT/JP2019/016784
Publication Date:
November 21, 2019
Filing Date:
April 19, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G02B5/20
Domestic Patent References:
| WO2014148276A1 | 2014-09-25 |
Foreign References:
| JP2015065268A | 2015-04-09 | |||
| JP2012256782A | 2012-12-27 | |||
| JP2010004018A | 2010-01-07 | |||
| JP2014154662A | 2014-08-25 | |||
| JP2010186818A | 2010-08-26 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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