SOLID STATE IMAGING ELEMENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC INSTRUMENT

Title:

SOLID STATE IMAGING ELEMENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC INSTRUMENT

Document Type and Number:

WIPO Patent Application WO/2016/170833

Kind Code:

A1

Abstract:

This solid state imaging element comprises a first semiconductor substrate equipped with at least a pixel array portion wherein pixels performing photoelectric conversion are disposed in a matrix form, and a second semiconductor substrate equipped with at least control circuit portions for driving the pixels, the first semiconductor substrate and the second semiconductor substrate being layered in a state in which the respective first surfaces on the side whereon the respective wiring layers have been formed are facing each other. Then, the pixel array portion comprises a plurality of fractional array portions resulting from a fractionation. The control circuit portions are provided so as to correspond to each of the plurality of fractional array portions and electric connections between the pixel array portions and the control circuit portions are established per unit of fractional array portion through electrodes disposed on the respective first surfaces of the first semiconductor substrate and the second semiconductor substrate.

Inventors:

SUKEGAWA SHUNICHI (JP)
MAEDA SHUNJI (JP)
ISHIBASHI JUNICHI (JP)
OKADA MOTOSHIGE (JP)

Application Number:

PCT/JP2016/054925

Publication Date:

October 27, 2016

Filing Date:

February 19, 2016

Export Citation:

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Assignee:

SONY CORP (JP)

International Classes:

H01L27/146; H01L27/14; H04N5/374; H04N5/378; G01S17/10

Domestic Patent References:

WO2014007004A1

2014-01-09

Foreign References:

JP2006352426A	2006-12-28
JP2008306695A	2008-12-18
JP2007123403A	2007-05-17
JP2011243862A	2011-12-01

Other References: