Title:
SOLID WIRE HAVING REDUCED SLAG
Document Type and Number:
WIPO Patent Application WO/2018/124591
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a solid wire comprising 0.02-0.08 wt% of carbon (C), 0.2-1.0 wt% of silicon (Si), 0.9-1.5 wt% of manganese (Mn), 0.01-0.035 wt% of titanium (Ti), 0.02-0.025 wt% of aluminum (Al), and the balance of iron (Fe) and impurities, wherein X represented by the following formula is 16-200.
X=[Al]/[Ti]*100
In the formula, [Ti] and [Al] are respectively the amounts (wt%) of titanium and aluminum with respect to the total weight of the solid wire.
Inventors:
KIM TAE HOON (KR)
KANG MUN CHAN (KR)
KANG MUN CHAN (KR)
Application Number:
PCT/KR2017/015030
Publication Date:
July 05, 2018
Filing Date:
December 19, 2017
Export Citation:
Assignee:
KISWEL LTD (KR)
International Classes:
B23K35/02; B23K9/16; B23K9/23; B23K35/30; C22C38/06; C22C38/14; B23K101/00; B23K101/34
Foreign References:
| JPH07100687A | 1995-04-18 | |||
| JP2009248121A | 2009-10-29 | |||
| JPH1147982A | 1999-02-23 | |||
| KR20030054288A | 2003-07-02 | |||
| KR100668169B1 | 2007-01-11 |
Attorney, Agent or Firm:
HANA IP LAW FIRM (KR)
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