TECHNICAL FIELD

The present disclosure relates generally to the field of semiconductor technologies; and more specifically, to resonators, such as Bulk Acoustic Wave (BAW) resonators. Further, the present disclosure relates to integrated circuit packages comprising a plurality of BAW resonators. Furthermore, the present disclosure relates to a method of manufacturing BAW resonators.

BACKGROUND

Acoustic wave devices, such as Micro-mechanical (MEMS) resonators, are key components used in modern electronic circuits as building blocks of front-end modules (FEM) due to their exceptional mechanical and acoustic quality, and considerably lower energy losses relative to their purely electrical counterparts (e.g. capacitors, inductors, etc.). For example, acoustic wave devices are used as filters to improve reception and transmission of signals in mobile phones and Wi-Fi receivers. There are two main categories of acoustic wave devices that are currently used by the industry to produce micro-mechanical resonators (filters). The first category of acoustic wave devices are based on surface traveling waves or Surface Acoustic Wave (SAW) resonators. These are traditionally fabricated on low loss piezoelectric material, and operated by coupling an external electric-field to the acoustic fields, creating a propagation of electro-acoustic modes into the piezoelectric material. The second category of acoustic wave devices include Bulk Acoustic Wave (BAW) resonators which use the external electric field to trigger bulk waves in the piezoelectric material. Whereas the SAW resonators tend to localize the acoustic energy into surface of the piezoelectric material, the BAW resonators tend to produce waves in the whole bulk of the piezoelectric material.

BAW resonators have been widely adapted to be used in high-frequency, communication applications, as they are usually quite compatible with state of the art micro-fabrication techniques which enables their use in a high yield, high volume and integration schemes for wireless chipset products. BAW resonators include thin film bulk acoustic resonators (FBARs), which include resonator stacks formed over a substrate cavity, and solidly mounted resonators (SMRs), which include resonator stacks formed over an acoustic reflector (e.g., Bragg mirror). Traditionally, the BAW resonator comprises a piezoelectric layer, and the thickness of the piezoelectric layer generally determines operating frequency of the BAW resonator. For instance, in case of SMR-BAW resonators operating in longitudinal modes, the operating frequency is mostly defined by the core resonator thickness of the piezoelectric material. If further frequencies are required on one same die, it is necessary to employ distinct mass loading elements, which are local variations in the electrode thickness and /or additional deposited materials (e.g., dielectrics) for a given resonator. Generally, the mass loading elements are deposited either over a top electrode, or below a bottom electrode in a Bragg layer structure.

It is to be noted that in case of multiple frequencies are required on one same die, the actual thickness variation of the different layers due to non-perfect manufacturing processes can in some cases be significantly larger than the fine thickness difference required to tune the operating frequency of different micro-resonators. In other words, it is challenging to implement a great number of frequency elements on the same die replicated across a full wafer, and thus it makes it more difficult in terms of actual processing to achieve many distinct operating frequencies. To mitigate this, additional highly controlled deposition steps are mandatory (i.e., require extremely high precision in the thickness deposition), but that increases manufacturing complexity, putting a trade-off between performance gains/ process cost. Further, it is to be considered that when mass loading elements are deposited below the bottom electrode in the Bragg layer structure, there is a need to ensure correct planarization of the subsequent deposition of thin-films.

Therefore, in light of the foregoing discussion, there exists a need to overcome the aforementioned drawbacks associated with conventional acoustic wave devices, and particularly BAW resonators, for facilitating the use of multiple frequencies all within one same die.

SUMMARY

The present disclosure seeks to provide a bulk acoustic wave (BAW) resonator, an integrated circuit package comprising a plurality of BAW resonators and a method of manufacturing a BAW resonator. An aim of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in prior art, and provides improved devices and methods of that are able to efficiently and reliably generate resonant frequencies. The present disclosure seeks to provide a solution to the existing problem of defining multiple operating frequencies for the BAW resonators. The present disclosure provides a novel methodology to lithographically define the operating frequency of surface-mounted resonators I bulk acoustic resonators (SMR-BAW).

The object of the present disclosure is achieved by the solutions provided in the enclosed independent claims. Advantageous implementations of the present disclosure are further defined in the dependent claims.

In an aspect, the present disclosure provides a bulk acoustic wave (BAW) resonator on a substrate. The bulk acoustic wave resonator comprises a piezoelectric element, a bottom electrode on a first face of the piezoelectric element and a top electrode on a second face of the piezoelectric element facing away from the first face. The BAW resonator further comprises a reflective element between the bottom electrode and the substrate. The reflective element comprises at least a first layer of a first material having a first acoustic impedance and a second layer of a second material having a second acoustic impedance different from the first acoustic impedance. The first or the second layer comprises one or more structures of a third material, having a third acoustic impedance different from the first and second impedances, said structures forming an acoustic impedance modulation layer embedded in the first and/or the second layer.

The BAW resonator of the present disclosure provide frequency shift without need for precise thickness deposition of different layers therein. Herein, the acoustic impedance modulation layer (AIML) enables to modulate the effective impedance of specific layer and therefore tune the operating frequency of the BAW resonator. Further, the AIML improves the acoustic confinement efficiency in the piezoelectric element of the BAW resonator. The AIML is also used to electrically shield any radiation and induced currents into the substrate of the BAW resonator.

In an implementation form, the reflective element is a Bragg layer comprising a plurality of interleaved first and second layers.

Herein, the reflective element being composed of alternating low impedance and high impedance acoustic material produce an acoustic reflector in the operating frequency of the BAW resonator which makes it possible to reflect, through phenomena of constructive interference, almost the totality of the incident energy. Further, interleaving of the first and second layers, with one being of low mechanical impedance and other being of relatively higher mechanical impedance, limit the leakage of energy to the substrate.

In an implementation form, the reflective element is composed of alternating layers of the first and second material in such a way that the reflecting element is arranged to operate in the operating frequency of the BAW resonator.

By allowing variation of the first and second material for the respective, alternating, first and second layers in the reflective element, with one of the first and second material being of low mechanical impedance and other being of relatively higher mechanical impedance, it is possible to tune the operating frequency of the BAW resonator.

In an implementation form, the acoustic impedance modulation layer is embedded in a layer of the reflective element adjacent the bottom electrode. The AIML being embedded adjacent to the bottom electrode (i.e., upper core section of the reflective element) allow to reduce noise in the signal (i.e., unwanted signals), and thus reduces interference and degradation of the signal, to be operated as a spurious mode reduction region.

In an implementation form, the one or more structures have a thickness in the order of the acoustic wavelength or a fraction of the acoustic wavelength, at the fundamental operating frequency of the BAW resonator.

Herein, the thickness of the one or more structures enables to modify the effective density of the reflective element, which impacts the acoustic propagation constants, and in turn modifies the phase velocities of the bulk waves propagating in that specific region to define the operating frequency of the BAW resonator. Therefore, the thickness of the one or more structures are determined based on order of the acoustic wavelength or a fraction of the acoustic wavelength, at the fundamental operating frequency of the BAW resonator.

In an implementation form, the one or more structures comprise a semiconductor material with a dopant concentration sufficiently large to enable a change in mass density and /or acoustic phase velocity.

With the acoustic impedance modulation layer being made of semiconductor material, varying dopant concentration therein, varies mass density of the acoustic impedance modulation layer and thereby acoustic phase velocity of the signal. The change in mass density and /or acoustic phase velocity modifies the acoustic impedance associated therewith, and thus allows for tuning of the operating frequency of the BAW resonator.

In an implementation form, the acoustic impedance modulation layer is arranged so that it extends into two layers of the reflective element.

The AIML extends into both the first and second layers of the reflective element so as to provide a structural geometry of the reflective element to provide the required frequency shift.

In an implementation form, the structures are distributed asymmetrically to form the acoustic impedance modulation layer.

Herein, the structures are distributed asymmetrically to help in the case of lateral spurious mode build-up, by creating asymmetric boundary conditions. Further, asymmetry in the AIML allows for varying acoustic impedance and mass density which can be used to tune the BAW resonator to the desired operating frequency. In an implementation form, a BAW resonator further comprises at least one mass load layer on the top electrode.

The mass load layer enables generating multiple frequencies on the same BAW resonator. The multiple frequencies are generated by varying thickness of the mass load layer.

In an implementation form, the mass load layer is embedded, or partially embedded in the top electrode.

The mass load layer is embedded, or at least partially embedded in the top electrode to provide for easy manufacturability.

In an aspect, an integrated circuit package is provided. The integrated circuit package comprises at least a first and a second BAW resonator. The first and second BAW resonators having different acoustic impedance modulation layers.

The integrated circuit package with the BAW resonators of the present disclosure provide distinct frequencies on a same die without, generally or substantially, increasing its overall size. The present integrated circuit package does not require precise thickness of the different layers of the first and second BAW resonators to achieve the purpose, thus reducing manufacturing complexity and overall cost. Further, the integrated circuit package provides minimum frequency spacing resolution achievable by adjacent first and second BAW resonators.

In an implementation form, the integrated circuit package comprises a plurality of BAW resonators configured in a ladder structure or a lattice structure.

The ladder structure and the lattice structure enables to fully optimize the transmission characteristics of a filter made by the plurality of BAW resonators. Herein, the ladder structure presents a high rejection close to the filter passband but a poor out of band rejection. On the other hand, the lattice structure exhibits higher out of band rejection but a poor rejection close to the filter passband. The integrated circuit package may combine these two structure configurations to obtain a mixed ladder-lattice filter to achieve desired properties.

In an aspect, a method of manufacturing BAW resonator is provided. The method comprises the step of depositing a reflective element on a substrate, said reflective element comprising at least a first and a second layer from a first and a second material having a first and second acoustic impedance, respectively. The method further comprises placing one or more structures of a third material having a third acoustic impedance different from the first and the second acoustic impedance, in the first and/or the second layer, said structures forming an acoustic impedance modulation layer within the reflective element.

The present method enables to manufacture the BAW resonator that provides frequency shift without need for precise thickness deposition of different layers of the bulk acoustic wave resonator. The AIML enables modulation in effective acoustic impedance of the reflective element, and the modulation in the effective impedance tunes the operating frequency of the resonator. Further, the AIML improves the acoustic confinement efficiency in the piezoelectric element.

In an implementation form, the step of placing the one or more structures comprises depositing a third layer of the third material on a first or a second layer and etching the third layer to form the structures. The method further comprises covering the third layer with a covering layer of the first or the second material and planarizing the covering layer.

Deposition of the third material varies density of the third layer to enable for modulation of the effective impedance of the reflective element and therefore tuning of the operating frequency of the BAW resonator. Etching the third layer removes material therefrom, in a pattern to form the structures. Planarization of the covering layer provides smooth surface of the covering layer ensure proper deposition of the subsequent thin-films in the BAW resonator.

In an implementation form, the step of placing the one or more structures comprises etching a first or second layer to create spaces for the structures, depositing a third layer of the third material and planarizing the third layer.

Etching process removes material from the first or second layer in a pattern so that the third material is filled in the spaces created in the first or second layer to form the structures. The structures collectively form the third layer (i.e. the acoustic impedance modulation layer). The third layer is planarized to ensure proper deposition of the subsequent thin-films in the BAW resonator.

In an implementation form, the acoustic modulation layer is lithographically defined and formed using one lithographic mask for the whole substrate.

In the present method, the acoustic modulation layer is formed in one go throughout the wafer for different BAW resonator units in the integrated circuit package, and does not require individual process steps for forming different resonator units, thereby reducing manufacturing complexity, time and cost. It has to be noted that all devices, elements, circuitry, units and means described in the present application could be implemented in the software or hardware elements or any kind of combination thereof. All steps which are performed by the various entities described in the present application as well as the functionalities described to be performed by the various entities are intended to mean that the respective entity is adapted to or configured to perform the respective steps and functionalities. Even if, in the following description of specific embodiments, a specific functionality or step to be performed by external entities is not reflected in the description of a specific detailed element of that entity which performs that specific step or functionality, it should be clear for a skilled person that these methods and functionalities can be implemented in respective software or hardware elements, or any kind of combination thereof. It will be appreciated that features of the present disclosure are susceptible to being combined in various combinations without departing from the scope of the present disclosure as defined by the appended claims.

Additional aspects, advantages, features and objects of the present disclosure would be made apparent from the drawings and the detailed description of the illustrative implementations construed in conjunction with the appended claims that follow.

BRIEF DESCRIPTION OF THE DRAWINGS

The summary above, as well as the following detailed description of illustrative embodiments, is better understood when read in conjunction with the appended drawings. For the purpose of illustrating the present disclosure, exemplary constructions of the disclosure are shown in the drawings. However, the present disclosure is not limited to specific methods and instrumentalities disclosed herein. Moreover, those in the art will understand that the drawings are not to scale. Wherever possible, like elements have been indicated by identical numbers.

Embodiments of the present disclosure will now be described, by way of example only, with reference to the following diagrams wherein:

FIG. 1 is an exemplary cross-sectional illustration of a bulk acoustic wave (BAW) resonator, in accordance with an embodiment of the present disclosure;

FIG. 2 is an exemplary cross-sectional illustration of a unit cell of the BAW resonator, in accordance with an embodiment of the present disclosure;

FIGs. 3A-3C are exemplary cross-sectional illustrations of the BAW resonator, in accordance with other embodiments of the present disclosure; FIG. 4A is an exemplary top view of an integrated circuit package with two different acoustic impedance modulation layers therein, in accordance with an embodiment of the present disclosure;

FIG. 4B is an exemplary cross-sectional illustration of the integrated circuit package of FIG. 4A along an axis AA’ thereof, in accordance with an embodiment of the present disclosure;

FIG. 5 is a flowchart listing steps involved in a method of manufacturing a BAW resonator, in accordance with an embodiment of the present disclosure; and

FIGs. 6A-6B are exemplary graphical representations of frequency shift in a BAW resonator, in accordance with an embodiment of the present disclosure.

In the accompanying drawings, an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent. A non-underlined number relates to an item identified by a line linking the nonunderlined number to the item. When a number is non-underlined and accompanied by an associated arrow, the non-underlined number is used to identify a general item at which the arrow is pointing.

DETAILED DESCRIPTION OF EMBODIMENTS

The following detailed description illustrates embodiments of the present disclosure and ways in which they can be implemented. Although some modes of carrying out the present disclosure have been disclosed, those skilled in the art would recognize that other embodiments for carrying out or practicing the present disclosure are also possible.

Reference in this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. The appearance of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Further, the terms “a” and “an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items. Moreover, various features are described which may be exhibited by some embodiments and not by others. Similarly, various requirements are described which may be requirements for some embodiments but not for other embodiments.

It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or “extending onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or “extending directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or “extending over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or “extending directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the drawings.

The present disclosure generally relates to acoustic wave devices which are key components used in modern electronic circuits. Acoustic wave devices are often employed in filter networks that require a flat passband. In acoustic wave devices, high frequency selectivity while maintaining low electric insertion loss requires high quality factor mechanical resonators coupled in a filter topology. Bulk Acoustic Wave (BAW) devices are mechanical resonators which couple an electrical, time varying signal, to a mechanical wave traveling in the bulk of a piezoelectric material. The fundamental mode of vibration at which the BAW devices are electromechanically coupled to is the thickness-extensional mode (TE) which are longitudinal waves propagating in the thickness of the thin piezoelectric membrane material. In some cases, other classes of piezoelectric material can be used, in which case the fundamental mode of vibration can also be the thickness-shear mode (TS). That is, the role of the TE and TS are interchanged depending on the core mode of vibration of the chosen piezoelectric material.

In order to achieve high quality electric signal, the mechanical resonance, generated within the resonators, needs to be as efficient as possible and generate the least mechanical loss. Mechanical loss in a BAW device is primarily arising from the acoustic radiation of mechanical energy into the substrate through the reflective element. Other routes of mechanical loss are radiation and scattering of the energy at the resonator edges, location where Bragg layers/ reflective elements are not located. Further, as the number of filter and device count increase in electronic devices, stringent requirements on the overall implementation size of filters are required, therefore requiring a reduced floor-plan area of the resonators and a decrease in distance between the resonators. Furthermore, the performance of these highly integrated filter solutions needs to be maintained, while at the same time improving yield and process cost.

Multiple frequency elements in one integrated circuit package are therefore required in order to improve the end performance of the filter. Conventional BAW devices are produced using a thin piezoelectric layer, disposed over a reflective element. In the case of thin-film bulk acoustic resonators (FBAR), the reflective element is a cavity; while in the case of solidly mounted acoustic resonators (SMR), the reflective element is an acoustic mirror or Bragg reflector comprising alternating layers of high and low acoustic impedance materials. In the case of SMR-BAW, the frequency tuning is achieved through the use of mass loading elements with varying deposited thickness. However, varying the deposited thickness (which needs to be with very fine control) will increase the manufacturing complexity when this number of frequency counts increase.

FIG. 1 is an exemplary illustration of a bulk acoustic wave (BAW) resonator 100, in accordance with an embodiment of the present disclosure. The bulk acoustic wave resonator 100 is a micro-resonator that generates high-precision and ultra-low jitter signal of specific frequencies. The BAW resonator 100 is also capable of generating signals with variable frequencies in both wired and wireless circuits. For example, the BAW resonator 100 may generate variable frequencies in range of 100 megahertz to 20 gigahertz. The BAW resonator 100 may be used in global positioning systems, data transfer (such as WLAN and Bluetooth), cellular mobile systems (such as CDMA, UMTS, GSM), satellite communications and military applications.

The BAW resonator 100 is built on a substrate 102 (sometimes, also referred to as a bulk). In particular, the BAW resonator 100 is deposited on the substrate 102. The substrate 102 acts as a base on which various elements or layers of the BAW resonator 100 are supported. The substrate 102 may be formed of various types of materials, including semiconductor materials compatible with semiconductor processes, which is useful for integrating connections and electronics, thus reducing size and cost. The substrate 102 may be fabricated using silicon, glass, ceramic, and a combination therefor. In an example, the substrate 102 may include, but is not limited to, silicon, silicon on insulator (SOI) technology substrate, gallium arsenide, gallium phosphide, gallium nitride, and indium phosphide. In another example, the substrate 102 may include an alloy semiconductor such as GaAsP, AllnAs, GalnAs, GalnP, GalnAsP or combinations thereof. In some examples, the BAW resonator 100 may include an electromagnetic shield provided on the substrate 102 that blocks radio frequency (RF) and electromagnetic radiation from adjacent resonator to reduce coupling losses such as eddy current losses in the substrate 102.

The BAW resonator 100 comprises a piezoelectric element 104. The piezoelectric element 104 is a layer of piezoelectric material that generates signals of desired resonance frequencies when an electric field (such as voltage) is applied to the piezoelectric element 104. In the BAW resonator 100, an electrical, time varying signal is coupled to a mechanical wave traveling in the bulk of the piezoelectric element 104. Generally, the thickness of the piezoelectric element 104 determines frequency of generated signal by the BAW resonator 100, and thus the frequency of the generated signal may be varied by varying the thickness of the piezoelectric element 104. Generally, the piezoelectric element 104 is a planar structure; however, the piezoelectric element 104 may be formed to have other shapes that may include, but is not limited to a cylindrical, conical and alike without any limitations.

The piezoelectric element 104 is, typically, a combination of undoped piezoelectric material and doped piezoelectric material, where the doped piezoelectric material may be doped with at least one rare earth element. Combining the undoped and doped piezoelectric material improves piezoelectric properties of the piezoelectric element 104, such as increasing the coupling coefficient over that of an entirely undoped piezoelectric material (e.g., Sc, Er). At the same time, the undoped and doped piezoelectric material reduces and more evenly distributes stress in the piezoelectric element 104, thereby reducing total compressive stress and more evenly distributing compressive stress over the substrate 102. In the present examples, the material used for fabricating the piezoelectric element 104 may include, but is not limited to, lithium niobate, lithium tantalate, aluminium nitride, zinc oxide and the like.

The BAW resonator 100 further comprises a bottom electrode 106 on a first face 104A of the piezoelectric element 104 and a top electrode 108 on a second face 104B of the piezoelectric element 104 facing away from the first face 104A. The top electrode 108 is placed on the second face 104B with direct contact with the piezoelectric element 104. In other words, the piezoelectric element 104 is sandwiched between the bottom electrode 106 at the first face 104A and the top electrode 108 at the second face 104B. Generally, the bottom electrode 106 is a planar structure; however, the bottom electrode 106 may be formed to have other shapes that may include, but is not limited to, a cylindrical, conical and the like without any limitations. The thickness for the bottom electrode 106 is chosen to give optimum acoustic properties to the BAW resonator 100. For instance, the thickness for the bottom electrode 106 is chosen to obtain maximum effective coupling and minimum Temperature Coefficient of Frequency (TCF).

The BAW resonator 100 is divided into an active region and an outside region. The active region generally corresponds to the section of the BAW resonator 100 where the bottom electrodes 106 and the top electrode 108 overlap and also includes the layers below the overlapping top and bottom electrodes 106 and 108. The outside region corresponds to the section of the BAW resonator 100 that surrounds the active region and it is not electrically driven. Although shown in FIG. 1 as each including a single layer, the bottom electrode 106 and/or the top electrode 108 may include multiple layers of the same material, multiple layers in which at least two layers are different materials, or multiple layers in which each layer is a different material. In the present examples, the material used for fabricating the bottom electrode 106 may include, but is not limited to, tungsten, titanium, tantalum, molybdenum, platinum, iridium, ruthenium or a combination thereof, and the material used for fabricating the top electrode 108 may include, but is not limited to, molybdenum, platinum, tungsten and iridium.

In accordance with an embodiment, the BAW resonator 100 further comprises at least one mass load layer 110 on the top electrode 108. The mass load layer 110 allows variations in thickness of the top electrode 108 of the BAW resonator 100. The mass load layer 110 enables generation of multiple resonant frequencies in the BAW resonator 100 by allowing varying its thickness in the BAW resonator 100. In an example, increase in thickness of the mass load layer 110 increases acoustic path length of the BAW resonator 100 which leads to a decrease of the resonant frequency thereof. In another example, decrease in thickness of the mass load layer 110 decreases acoustic path length of the BAW resonator 100 which leads to an increase of the resonant frequency thereof. In an alternate example, the BAW resonator 100 may include the mass load layer 110 on the bottom electrode 106 without departing from the scope of the present disclosure. In some examples, the BAW resonator 100 may include multiple mass load layers 110 on the top electrode 108 to further shift the resonant frequency thereof.

The mass load layer 110 may correspond to a thickened portion of the top electrode 108 or the application of additional layers of an appropriate material over the top electrode 108. The mass load layer 110 extends about the periphery of the active region in the top electrode 108. Thus, the portion of the BAW resonator 100 that includes and resides below the mass load layer 110 is referred to as an active region. In an example, the mass load layer 110 may be fabricated from a conductive substrate such as, but not limited to, tungsten, tungsten alloys, molybdenum, aluminium, iridium, and platinum. In another example, the mass load layer 110 may be fabricated from a dielectric material such as, but not limited to, silicon dioxide, silicon nitride, diamond, and amorphous aluminium nitride. In general, the mass load layer 110 may be a single metal layer like tungsten, or may be an alloy like AICu or may be multiple layers of metal like tungsten and AICu. In accordance with an embodiment, the mass load layer 110 is embedded, or partially embedded in the top electrode 108. The mass load layer 110 is embedded in the top electrode 108 by deposition of the mass loading material substantially along the edges of the top electrode 108 to define a border region. The defined border region area may have certain areas particularly at the corners depleted of metal allowing for the bottom electrode 106 to extend to a lead connection without experiencing a direct electric field. The mass load layer 110 may be provided as, by various examples, a frame-like structure formed from a metal heavier than the metal of the top electrode 108 and from various formations of the frame-like structure proximate the top electrode 108 including outside, above, below, and between a layered electrode. It may be appreciated that this is in contrast to conventional BAW resonators where the mass load layer is placed on the top electrode to generally create a mechanical loading and a downward shift in the operating frequency.

The BAW resonator 100 further comprising a reflective element 112 between the bottom electrode 106 and the substrate 102. The reflective element 112 is also referred as an acoustic mirror or a Bragg reflector. The reflective element 112 comprises alternating layers of high and low acoustic impedance materials to generate resonance signal of desired frequency. The reflective element 112 may be manufactured using dielectric materials that may include, but not limited to, SiCOH, a phosphosilicate glass, an oxide or a nitride of aluminium, silicon, germanium, gallium, indium, tin, antimony, tellurium, bismuth, titanium, vanadium, chromium, manganese, cobalt, nickel, copper, zinc, zirconium, niobium, molybdenum, palladium, cadmium, hafnium, tantalum, tungsten, or a combination thereof. Optionally, the reflective element 112 may be manufactured using fibre grating or semiconductor material, such as silicon oxide.

The said reflective element 110 comprises at least a first layer 114A of a first material having a first acoustic impedance and a second layer 114B of a second material having a second acoustic impedance different from the first acoustic impedance. That is, the first layer 114A and the second layer 114B have different acoustic impedances. Acoustic impedance is the product of media density through which the signal travels and the velocity of the signal wave. Herein, the first layer 114A and the second layer 114B are made of different material for having different acoustic impedances. The materials with low acoustic impedance are typically low-density materials. In the present examples, the material used for low acoustic impedance layer (for example, the first layer 114A) may include, but not limited to, silicon dioxide, aluminium and SiOC. Further, the materials with high acoustic impedance are typically high- density materials. In the present examples, the material used for high acoustic impedance layer (for example, the second layer 114B) may include, but not limited to, iridium, molybdenum and tungsten.

In accordance with an embodiment, the reflective element 112 is composed of alternating layers of the first and second material in such a way that the reflecting element 112 is arranged to operate in the operating frequency of the BAW resonator. That is, the reflective element 112 comprises layers of low acoustic impedance material and high acoustic impedance material that are arranged alternately. For example, the reflective element 112 comprises the first layer 114A followed by the second layer 114B which is again followed by another first layer 114A and another second layer 114B so on to form alternate layers of the first layer 114A and the second layer 114B. This is done so to produce a significant reflection coefficient at the junction of adjacent layers in the reflective element 112. The thickness and distance between the first layer 114A and the second layer 114B are determined based on an intended resonant frequency of the BAW resonator 100, to cause constructive interference at that frequency. In one example, the thickness of the first layer 114A and the second layer 114B corresponds to one quarter of the wavelength of the designed frequency, and the distance between the first layer 114A and the second layer 114B is half the wavelength of the designed frequency.

In accordance with an embodiment, the reflective element 112 is a Bragg layer comprising a plurality of interleaved first and second layers 114A and 114B. Herein, the Bragg layer is a succession of planar surfaces with different acoustic impedances. It makes it possible to reflect, through phenomena of constructive interference, almost the totality of the incident signals. This is possible provided that the incident signal wave is close to the normal incidence. As discussed, the reflective element 112 includes a plurality of layers, including the first layer 114A and the second layer 114B that are spaced apart. The plurality of layers, including the first layer 114A and the second layer 114B are arranged alternatively in the Bragg layer configuration of the reflective element 112. Each layer boundary causes a partial reflection of the signal wave. For waves whose vacuum wavelength is close to four times the thickness of the layers, many reflections combine with constructive interference, and thus the Bragg layer, overall, acts as a high-quality filter.

The first or the second layer 114A and 114B comprises one or more structures of a third material, having a third acoustic impedance different from the first and second impedances, said structures forming an acoustic impedance modulation layer 116 embedded in the first and/or the second layer 114A and 114B. In an example, the acoustic impedance modulation layer 116 may be embedded either in the first layer 114A or the second layer 114B. In another example, the acoustic impedance modulation layer 116 may be embedded in both the first layer 114A and the second layer 114B. In the example illustration of FIG. 1 , the first layer 114A is shown to include four structures 116A, 116B, 116C and 116D collectively forming the acoustic impedance modulation layer 116. The structures 116A, 116B, 116C and 116D are distinct patches on the first layer 114A that are used to tune the operating frequency of the BAW resonator 100. In an example, the acoustic impedance modulation layer 116 is formed of a dielectric material that may include, but not limited to, SiN, SiO2, AIN or a combination thereof. In another example, the acoustic impedance modulation layer 116 is formed of a conductor material that may include, but not limited to, aluminium, tungsten, platinum and combination thereof. Specifically, the structures 116A, 116B, 116C and 116D are made of the third material different from the first material of the first layer 114A and the second material of the second layer 114B, with the third material having the third acoustic impedance different from the first acoustic impedance of the first layer 114A and the second acoustic impedances of the second layer 114B.

The different acoustic impedances (as well as different densities due to different corresponding materials) of the first layer 114A, the second layer 114B and the acoustic impedance modulation layer 116 enables to modify the effective impedance (as well as effective density) of the reflective element 112. The modulation in the effective impedance directly impacts acoustic propagation constants, which in turns modifies velocity of the signal in that specific region and thus, impacts the overall operating frequency of the BAW resonator 100. This way the acoustic impedance modulation layer 116 tunes the operating frequency of the BAW resonator 100. Further, the acoustic impedance modulation layer 116 improve the acoustic confinement efficiency in the piezoelectric element 104. In some examples, the acoustic impedance modulation layer 116 may further be patterned to vary density of the one or more structures 116A, 116B, 116C and 116D to enhance modulation of the effective impedance of the reflective element 112 and therefore tune the operating frequency of the BAW resonator 100.

FIG. 2 is an exemplary illustration of a unit cell 200 of the BAW resonator (such as, the BAW resonator 100 of FIG. 1), in accordance with an embodiment of the present disclosure. FIG. 2 has been described in conjunction with elements from FIG. 1. With reference to FIG. 2, there is shown relative position and deposition thickness of different components or layers of the BAW resonator 100. As illustrated, the BAW resonator 100 comprises the substrate 102 as a bottom layer and the piezoelectric element 104 as a top layer. The reflective element 112 is placed between the substrate 102 and the piezoelectric element 104. The bottom electrode 106 is placed on the first face 104A of the piezoelectric element 104 between the piezoelectric element 104 and the reflective element 112. The reflective element 112 comprises the acoustic impedance modulation layer 116 arranged with the first layer 114A or the second layer 114B. As shown, the acoustic impedance modulation layer 116 is embedded near the bottom electrode 106 at a distance of L1 from the bottom electrode 106. Further, the acoustic impedance modulation layer 116 has a deposition thickness of L2. In accordance with an embodiment, the one or more structures 116A, 116B, 116C and 116D comprise a semiconductor material with a dopant concentration sufficiently large to enable a change in mass density and /or acoustic phase velocity. Herein, the acoustic impedance modulation layer 116 comprises the semiconductor material with varying dopant concentration to vary mass density thereof and acoustic phase velocity of the resonance signal generated by the BAW resonator 100. It may be contemplated that such change in mass density and /or acoustic phase velocity overall modifies the third acoustic impedance in the reflective element 112. Thus, the semiconductor material in the acoustic impedance modulation layer 116 allows tuning of the operating frequency of the bulk acoustic wave resonator 100. In the present examples, the semiconductor material may be n-type or p-type material. In an example, the semiconductor material used for the one or more structures may include, but is not limited to, silicon, germanium, silicon carbide, silicon germanium, boron, arsenic, phosphorus and a combination thereof.

In accordance with an embodiment, the one or more structures 116A, 116B, 116C and 116D have a thickness in the order of the acoustic wavelength or a fraction of the acoustic wavelength, at the fundamental operating frequency of the BAW resonator 100. As discussed earlier, it may be appreciated that the thickness of the structures 116A, 116B, 116C and 116D is determined based on an intended resonant frequency of the BAW resonator 100. In the BAW resonator 100 of the present disclosure, the thickness of the one or more structures 116A, 116B, 116C and 116D corresponds to one quarter of the wavelength of the intended frequency. Further, the fundamental operating frequency of the BAW resonator 100, generally, decreases with increase in the thickness of the one or more structures 116A, 116B, 116C and 116D.

In accordance with an embodiment, the structures 116A, 116B, 116C and 116D are distributed asymmetrically to form the acoustic impedance modulation layer 116. Herein, the acoustic impedance and the density of the acoustic impedance modulation layer 116 is varied through variations in implementations of the structures 116A, 116B, 116C and 116D therein. This way the asymmetry in the acoustic impedance modulation layer 116 allows for varying acoustic impedance and mass density thereof, which can be used to tune the BAW resonator 100 to the desired operating frequency. In particular, the asymmetry in distribution of the structures 116A, 116B, 116C and 116D helps in the case of lateral spurious mode build-up, by creating asymmetric boundary conditions. Herein, the positions of the structures 116A, 116B, 116C and 116D in the reflective element 112, in order to form the acoustic impedance modulation layer 116, are determined according to the frequency shift required to tune the BAW resonator 100. Further, the structural geometry of the structures 116A, 116B, 116C and 116D, in order to form the acoustic impedance modulation layer 116, is also determined according to the frequency shift required to tune the BAW resonator 100.

FIG. 3A is an illustration of a BAW resonator 300A, in accordance with another embodiment of the present disclosure. FIG. 3 is described in conjunction with elements of the BAW resonator 100 from FIG. 1 which are generally similar in configuration. The BAW resonator 300A comprises the substrate 102 and the piezoelectric element 104. The BAW resonator 300A also comprises the reflective element 112 between the substrate 102 and the piezoelectric element 104. The BAW resonator 300A further comprises the bottom electrode 106 between the first face 104A of the piezoelectric element 104 and the reflective element 112. The reflective element 112 comprises an acoustic impedance modulation layer 302 formed in the first layer 114A and/or the second layer 114B.

The acoustic impedance modulation layer 302 comprises a plurality of structures 302A, 302B, 302C 302D, 302E and 302F. The structures 302A, 302B, 302C 302D, 302E and 302F are distributed asymmetrically to form the acoustic impedance modulation layer 302. The asymmetry in arrangement of the structures 302A, 302B, 302C 302D, 302E and 302F provides variation in mass density and acoustic phase velocity of the signal of the acoustic impedance modulation layer 302 that enables variable acoustic impedance in the acoustic impedance modulation layer 302. Hence, asymmetry in arrangement of the structures 302A, 302B, 302C 302D, 302E and 302F enables tuning of the BAW resonator 300A to define its operating frequency. Further, asymmetry in arrangement of the structures 302A, 302B, 302C 302D, 302E and 302F cancels unwanted signals and noises in the signal thus, reduces interference and degradation of the signal. Thereby, the asymmetry helps in the case of lateral spurious mode build-up by creating asymmetric boundary conditions. In the present embodiments, the position of the structures 302A, 302B, 302C 302D, 302E and 302F, in order to form the acoustic impedance modulation layer 302, are determined according to the frequency shift required to tune the BAW resonator 300A. Further, the structural geometry and the thickness of the structures 302A, 302B, 302C 302D, 302E and 302F, in order to form the acoustic impedance modulation layer 302, are also determined according to the frequency shift required to tune the BAW resonator 300A.

In accordance with an embodiment, the acoustic impedance modulation layer 116 is embedded in a layer of the reflective element 112 adjacent the bottom electrode 106. The acoustic impedance modulation layer 116 being embedded adjacent to the bottom electrode 106 (i.e., upper core section of the reflective element 112) allow to reduce noise in the signal (i.e., unwanted signals), and thus reduces interference and degradation of the signal. This way the acoustic impedance modulation layer 116 is operated as a spurious mode reduction region due to the build-up of lateral traveling waves. Depending on the dispersion characteristics of these laterally propagating mode, the acoustic impedance modulation layer can provide the necessary boundary condition at the edges of the core resonator region to reduce the build-up of spurious modes. This has a strong influence on performance of the BAW resonator 100. Alternatively, the acoustic impedance modulation layer 116 may be embedded in the reflective element 112 adjacent to the substrate 102 without departing from the scope and the spirit of the present disclosure.

FIG. 3B is an illustration of a BAW resonator 300B, in accordance with yet another embodiment of the present disclosure. FIG. 3B is described in conjunction with elements of the BAW resonator from FIGs. 1 and 3A which are generally similar in configuration. The BAW resonator 300B comprises the substrate 102 and the piezoelectric element 104. The BAW resonator 300B also comprises the reflective element 112 between the substrate 102 and the piezoelectric element 104. The BAW resonator 300B further comprises the bottom electrode 106 between the first face 104A of the piezoelectric element 104 and the reflective element 112. The reflective element 112 comprises an acoustic impedance modulation layer 302 formed in the first layer 114A and/or the second layer 114B. The acoustic impedance modulation layer 302 comprises a plurality of structures 302A, 302B, 302C 302D, 302E and 302F. The structures 302A, 302B, 302C 302D, 302E and 302F are embedded in the first layer 114A of the reflective element 112 adjacent the bottom electrode 106.

Herein, the acoustic impedance modulation layer 302 is embedded in the first layer 114A. In an implementation, first the third material is deposited on the first layer 114A, then the acoustic impedance modulation layer 302 is etched by forming the structures 302A, 302B, 302C 302D, 302E and 302F, and thereafter the acoustic impedance modulation layer 302 is covered with the covering layer (not shown) of the first material of the first layer 114A. In another implementation, first the first layer 114A is etched to create spaces to form the structures 302A, 302B, 302C 302D, 302E and 302F, then the third material is deposited in the formed structures 302A, 302B, 302C 302D, 302E and 302F to form the acoustic impedance modulation layer 302, and thereafter the acoustic impedance modulation layer 302 is covered with the covering layer (not shown) of the first material of the first layer 114A. In some examples, the acoustic impedance modulation layer 302 is planarized before embedding (i.e. before applying the covering layer) in the first 114A that significantly improves smoothness of the surface of the acoustic impedance modulation layer 302. Planarization of the surface of the acoustic impedance modulation layer 302 may be performed using chemical mechanical polishing (CMP) technique, for instance.

In accordance with an embodiment, the acoustic impedance modulation layer 116 is arranged so that it extends into two layers of the reflective element 112. Herein, the acoustic impedance modulation layer 116 extends into the first layer 114A and the second layer 114B. As discussed, in some examples, the acoustic impedance modulation layer 116 may be embedded in both the first layer 114A and the second layer 114B. According to an embodiment, the third layer of the third material is deposited on the first or the second layer 114A and 114B, and then the third layer is etched to form the structures 116A, 116B, 116C and 116D, and thereafter the third layer is covered with a covering layer (not shown) of the first or the second material. According to another embodiment, the first or the second layer 114A and 114B is etched to create spaces to form the structures 116A, 116B, 116C and 116D, and then the third layer of the third material is deposited thereon. In some examples, the acoustic impedance modulation layer 116 is planarized before embedding in the first 114A and/or the second layer 114B that significantly improves smoothness of the surface of the acoustic impedance modulation layer 116. Planarization of the surface of the acoustic impedance modulation layer 116 may be performed using chemical mechanical polishing (CMP) technique, for instance.

FIG. 3C is an illustration of a BAW resonator 300C, in accordance with still another embodiment of the present disclosure. FIG. 3C is described in conjunction with elements of the BAW resonator from FIGs. 1 , 3A and 3B which are generally similar in configuration. The BAW resonator 300C comprises the substrate 102 and the piezoelectric element 104. The BAW resonator 300C also comprises the reflective element 112 between the substrate 102 and the piezoelectric element 104. The BAW resonator 300C further comprises the bottom electrode 106 between the first face 104A of the piezoelectric element 104 and the reflective element 112. The reflective element 112 comprises an acoustic impedance modulation layer 302 formed in the first layer 114A and/or the second layer 114B. The acoustic impedance modulation layer 302 comprises a plurality of structures 302A, 302B, 302C 302D, 302E and 302F. The structures 302A, 302B, 302C 302D, 302E and 302F are embedded in both the first layer 114A and second layer 114B of the reflective element 112.

Herein, the acoustic impedance modulation layer 302 is extending into and embedded in both the first layer 114A and second layer 114B. In an implementation, the third material is deposited between the first layer 114A and second layer 114B, and then the structures 302A, 302B, 302C 302D, 302E and 302F are etched therein to form the acoustic impedance modulation layer 302. In another implementation, the gap between the first layer 114A and second layer 114B is etched to create spaces, and then the formed spaces are deposited (i.e. filed) with the third material to form the structures 302A, 302B, 302C 302D, 302E and 302F with the acoustic impedance modulation layer 302 therein.

FIGS. 4A-4B are illustrations of an integrated circuit package 400, in accordance with an embodiment of the present disclosure. Examples of the integrated circuit package 400 includes, but are not limited to, a digital logic circuit, an analog circuit, a processor core, a digital signal processor (DSP) core etc. The integrated circuit package 400 may be made of any suitable material, and may have any suitable shape, dimensions, etc. without any limitations. The integrated circuit package 400 may be a wafer-level package, or a die-level package. For example, the integrated circuit package 400 may include a plurality of identical, integrally connected wafer portions that each contain identical structure and circuitry. These identical portions may later be separated in a die forming process, if required. The integrated circuit package 400 of the present disclosure may include a Microelectromechanical (MEMS) structure, such as bulk acoustic wave (BAW) structure, formed at the top of the wafer. Multiple MEMS structures, such as BAW structures or others, could be provided on each wafer portion, or such multiple MEMS structures could be contained in one or multiple cavities in wafer portions.

The integrated circuit package 400 comprises at least a first and a second BAW resonator 402A and 402B. In the present embodiments, the integrated circuit package 400 is a semiconductor-based device (or a chip) having the first and the second BAW resonators 402A and 402B connected to each other. Although, in the illustration of FIGs. 4A-4B, the integrated circuit package 400 is shown to include two BAW resonators, namely the first BAW resonator 402A and the second BAW resonator 402B; however, it may be appreciated that the integrated circuit package 400 may include more than two BAW resonators without any limitations.

Hereinafter, FIGs. 4A-4B have been described in conjunction with elements described in FIGs. 1 and 3. In some examples, the first BAW resonator 402A and the second BAW resonator 402B may be similar to each other. However, in preferred examples, the first BAW resonator 402A and the second BAW resonator 402B are different in configuration from each other to generate different resonance frequencies in the integrated circuit package 400. In an embodiment, the first BAW resonator 402A and the second BAW resonator 402B may be similar to the BAW resonator 300A, as discussed in the preceding paragraphs. Herein, the first BAW resonator 402A and the second BAW resonator 402B have different acoustic impedance modulation layers. That is, the first BAW resonator 402A has an acoustic impedance modulation layer 404A similar to the acoustic impedance modulation layer 116 and the second BAW resonator 402B has an acoustic impedance modulation layer 404B similar to the acoustic impedance modulation layer 302. Different acoustic impedance modulation layers 404A and 404B allow multiple frequencies on the same integrated circuit package 400 without any need for precise thickness deposition of different layers of the first BAW resonator 402A and the second BAW resonator 402A (as conventionally required).

As discussed, the first BAW resonator 402A and the second BAW resonator 402B may each include corresponding acoustic impedance modulation layer 404A and 404B. As depicted in FIGs. 4A-4B, the acoustic impedance modulation layer 404A of the first BAW resonator 402A includes one or more structures 406A, and the acoustic impedance modulation layer 404B of the second BAW resonator 402B includes one or more structures 406B. It may be appreciated that different acoustic impedance modulation layers 404A and 404B may be formed by using different patterns, geometries, relative positions, doping concentrations, and the like of the one or more structures 406A and 406B therein.

As shown, the integrated circuit package 400 has a generally flat top surface and a generally flat bottom surface. The integrated circuit package 400 includes a substrate 408 (similar to the substrate 102) common to the first BAW resonator 402A and the second BAW resonator 402B, onto which the first BAW resonator 402A and the second BAW resonator 402B are deposited. The integrated circuit package 400 also includes a piezoelectric layer 410 (similar to the piezoelectric layer 104) and a reflective element 412 (similar to the reflective element 112). The first BAW resonator 402A includes a bottom electrode 414A and the second BAW resonator 402B comprises a bottom electrode 414B (both similar to the bottom electrode 106).

Further, the reflective element 412 comprises alternating layers of high and low acoustic impedance materials to generate signal of desired frequency. In particular, the reflective element 412 includes a first layer 416A and a second layer 418A for the first BAW resonator 402A, and a first layer 416B and a second layer 418B for the second BAW resonator 402B. The first layers 416A, 416B and the corresponding second layers 418A, 418B are the layers of different acoustic impedances. The first layers 416A, 416B have the first acoustic impedance and the second layers 418A, 418B have the second acoustic impedance, with, for example, the first acoustic impedance being lower than the second acoustic impedance.

In the present embodiments, the structures 406A and 406B reduce radio frequency and eddy current loss to the substrate 408 by opening out a current loop formation. The structures 406A and 406B comprise varying pitch and patch size throughout to form the corresponding acoustic impedance modulation layers 404A and 404B. The varying pitch and patch size enable asymmetry in the acoustic impedance modulation layers 404A and 404B that helps in the case of lateral spurious mode build-up by creating asymmetric boundary conditions.

In accordance with an embodiment, the integrated circuit package 400 comprises a plurality of BAW resonators 402A and 402B configured in a ladder structure or a lattice structure. As the integrated circuit package 400 is used to construct a micro-mechanical filter with fine optimization possible of the in-band ripple, herein the micro-mechanical filter is obtained by electrical interconnection of multiple individual BAW resonators similar to that of the BAW resonators 402A and 402B in either the ladder type structure or the lattice type structure. In a ladder structure, multiple BAW resonators 402A and 402B are arranged in a series-shunt configuration. For example, the first BAW resonator 402A is arranged in series followed by the second BAW resonator 402B which is arranged in shunt, and which is again followed by the first BAW resonator 402A arranged in series and so on. In the lattice structure, multiple BAW resonators 402A and 402B are arranged as crystal lattice. The ladder structure and the lattice structure enables to fully optimize the transmission characteristics of a filter provided by the integrated circuit package 400 made by the plurality of BAW resonators 402A and 402B. Herein, the ladder structure presents a high rejection close to the filter passband but a poor out of band rejection. On the other hand, the lattice structure exhibits higher out of band rejection but a poor rejection close to the filter passband. The integrated circuit package 400 may combine these two structure configurations to obtain a mixed ladder-lattice filter to achieve desired properties.

FIG. 5 is a flowchart of a method 500 of manufacturing a BAW resonator, in accordance with an embodiment of the present disclosure. The various embodiments and variants disclosed above apply mutatis mutandis to the method of manufacturing the BAW resonator. It will be appreciated that the method may vary as to the specific steps and sequence, without departing from the scope and the spirit of the present disclosure.

At step 502, a substrate (such as, the substrate 102 of FIG. 1) is provided. The substrate acts as a base on which various elements or layers of the BAW resonator are supported. At step 504, a reflective element (such as, the reflective element 112 of FIG. 1) is deposited on a substrate (such as, the reflective element 102 of FIG. 1). The reflective element is also referred as an acoustic mirror or a Bragg reflector. The reflective element comprises alternating layers of high and low acoustic impedance materials to generate resonance signal of desired frequency. Further, a piezoelectric element (such as, the piezoelectric element 104 of FIG. 1) is deposited on the reflective element.

At step 506, a first layer and a second layer (such as, the first layer 114A and the second layer 114B of FIG. 1) are deposited on the reflective element. The first and the second layer are fabricated from a first and a second material having a first and second acoustic impedance, respectively. That is, the first layer and the second layer are the layers of different acoustic impedances. The first layer has the first acoustic impedance and the second layer has the second acoustic impedance. The material used for low acoustic impedance layer (for example, the first layer) may include, but is not limited to silicon dioxide, aluminium and SiOC. The material used for high acoustic impedance layer (for example, the second layer) may include, but is not limited to iridium, molybdenum and tungsten. The reflective element is composed of alternating layers of the first and second layer in such a way that the reflecting element is arranged to operate in the operating frequency of the BAW resonator. For example, the reflective element comprises the first layer followed by the second layer which is again followed by another the first layer and so on to form alternate layers of the first layer and the second layer.

At step 508, one or more structures of a third material having a third acoustic impedance different from the first and the second acoustic impedance is placed in the first and/or the second layer. The said structures forms an acoustic impedance modulation layer (similar to the acoustic impedance modulation layer 116 of FIG. 1) within the reflective element. The acoustic impedance modulation layer is embedded either in the first layer or/and the second layer. The different acoustic impedances of the first layer, the second layer and the acoustic impedance modulation layer enables to modify the effective impedance (as well as effective density) of the reflective element. The modulation in the effective impedance directly impacts acoustic propagation constants, which in turns modifies velocity of the signal in that specific region and thus, impacts the overall operating frequency of the resonator. Thus, the acoustic impedance modulation layer tunes the operating frequency of the BAW resonator. Further, the acoustic impedance modulation layer generates multiple resonant frequencies from the same BAW resonator without need of controlling precise thickness of different layers of the resonator. Further, the acoustic impedance modulation layer improves the acoustic confinement efficiency in piezoelectric element of the BAW resonator.

In accordance with an embodiment, the step of placing the one or more structures comprises depositing a third layer of the third material on a first or a second layer and etching the third layer to form the structures, the method further comprising covering the third layer with a covering layer of the first or the second material and planarizing the covering layer. Etching process is used to remove material from the acoustic impedance modulation layer (i.e. the third layer) in a pattern to form the structures. The material may be removed by coating the acoustic impedance modulation layer with photoresist or a hard mask (usually oxide or nitride) and exposing the acoustic impedance modulation layer to a pattern during photolithography. The structures vary density of the third layer to enables to modulate the effective impedance of the reflective element and therefore tune the operating frequency of the BAW resonator. Further, the structures enable to generate multiple resonant frequencies from the same BAW resonator. Thus, the structures of the acoustic impedance modulation layer dictate the frequency shifts and enables a fine control of the frequency spacing in the BAW resonator. Further, the covering layer comprises of either the first or the second material (depending on the which of the first layer or the second layer is etched) is deposited. The covering layer is planarized to ensure proper deposition of the subsequent thin-films in the BAW resonator. The covering layer may be planarized using chemical mechanical polishing (CMP) technique that uses combined chemical and mechanical methods involving an abrasive and corrosive chemical slurry (commonly a colloid) to achieve ultra-precision polishing of the surface of the covering layer, and thereby the third layer in the reflective element.

In accordance with an embodiment, the step of placing the one or more structures comprises etching a first or second layer to create spaces for the structures, depositing a third layer of the third material and planarizing the third layer. Etching process may be used to remove material from the first or second layer in a pattern so that the third material is filled in the spaces created in the first or second layer to form the structures. The structures collectively form the acoustic impedance modulation layer for the BAW resonator. Herein, the third layer is planarized to ensure proper deposition of the subsequent thin-films in the BAW resonator. The third layer may be planarized using chemical mechanical polishing (CMP) technique that uses combined chemical and mechanical methods involving an abrasive and corrosive chemical slurry (commonly a colloid) to achieve ultra-precision polishing of the surface of the third layer.

In accordance with an embodiment, the acoustic modulation layer is lithographically defined and formed using one lithographic mask for the whole substrate. Lithographically defined acoustic impedance modulation layer allows multiple frequencies to be designed on one substrate. Hence, if we need N separate frequencies, we don’t need N different process steps to form each of the different N resonators. It will be appreciated that the lithographically defined acoustic impedance modulation layer provides minimum frequency spacing resolution between adjacent resonators. Using one lithographic mask for the whole substrate, the acoustic modulation layer is formed in one go throughout the wafer for different BAW resonator units in the integrated circuit package, and does not require individual process steps for forming different resonator units, thereby reducing manufacturing complexity, time and cost.

FIGs. 6A-6B are exemplary graphical representations of frequency shift in the BAW resonator 100, in accordance with an embodiment of the present disclosure. With reference to FIG. 6A, the graphical representation 600A represents frequency shifting of the BAW resonator 100 with a/p ratio of 2. Herein, the a/p ratio is the ratio between surface and perimeter of the BAW resonator 100. The a/p ratio depends on the shape of the resonator. For a given value of ‘a’, a/p is larger for a square than for a triangle and is the largest for a circle. Independent of the shape, a/p ratio always increases with increasing value of ‘a’. Therefore, large resonators have large value of a/p ratio, and small resonators have comparatively small value of a/p ratio. In the graphical representation 600A, line 602 represents frequency shift of the BAW resonator 100. The frequency shift is achieved by the acoustic impedance modulation layer of the BAW resonator 100. With reference to FIG. 6B, there is also shown a graphical representation 600B that represents frequency shifting of the BAW resonator 100 when a/p ratio of the BAW resonator 100 is 4. In the graphical representation 600B, line 604 represents frequency shift of the BAW resonator 100. The frequency shift is achieved by the same acoustic impedance modulation layer of the BAW resonator 100. Hence, it may be understood that modulation in a range of frequency shift is obtained depending on the design from single BAW resonator 100 by using the acoustic impedance modulation layer configuration. It is to be noted that, herein, the quality factor (Q) and electromechanical coupling coefficient (kt2) factors are maintained. The configuration provides fine frequency tuning wit =h ripple enhancement (similar to SAW resonators). Further, it may be understood that the dispersion type of BAW resonator can be shifted (via lithography) to provide spurious mode suppression options.

The BAW resonator 100 of the present disclosure relies on the deposition and patterning of the acoustic impedance modulation layer 116 in the upper core section of the reflective element 112. The inclusion of distinct material patches in this upper core section of the reflective element 112 enables to modify the effective density of the first layer 114A (or, the second layer 114B), which directly impacts the acoustic propagation constants, which in turns modifies the phase velocities of the bulk waves propagating in that specific region. This modification of acoustic parameters impacts the overall operating frequency of the BAW resonator 100. It is to be noted that this tuning of the effective impedance and effective density is solely done through variations in implementations of the patterned shape of the acoustic impedance modulation layer 116. The acoustic impedance modulation layer 116 is patterned in one go on the full wafer surface and enables a lithographically defined modulation of effective density of the first layer 114A (or, the second layer 114B). Adjacent BAW resonators can therefore have distinct frequencies even though they are located on the same die.

The present BAW resonator 100 achieves frequency shift setup by lithography of the acoustic impedance modulation layer 116 without need for precise thickness deposition (as conventionally required). With such design, many frequencies can be achieved on same wafer and fine optimizations are possible of the in-band ripple. Herein, the acoustic impedance modulation layer 116 can be setup close to the bottom electrode 106 (i.e. close to edge of the BAW resonator 100) and thus can operate as a spurious mode reduction/ frame region. The acoustic impedance modulation layer 116 is also used to electrically shield any radiation and induced currents into the substrate 102. Further, the acoustic impedance modulation layer 116 adds an additional optimization parameter to improve the acoustic confinement efficiency in the piezoelectric element 104. Furthermore, the acoustic impedance modulation layer 116 with the added dummy elements can significantly improve the planarization of the surface prior to the deposition of the core piezoelectric element 104.

Bulk Acoustic Wave (BAW) resonator of the present disclosure can be used in many high- frequency, communication applications. In particular, the present BAW resonator can be employed in filter networks that operate at frequencies above 1.5 GHz and require a flat passband; have exceptionally steep filter skirts and squared shoulders at the upper and lower ends of the passband; and provide excellent rejection outside of the passband. The present BAW resonator has relatively low insertion loss, tend to decrease in size as the frequency of operation increases, and are relatively stable over wide temperature ranges. As such, the present BAW resonator can be used in many 3rd Generation (3G) and 4th Generation (4G) wireless devices, and further in filter applications for 5th Generation (5G) wireless devices. It may be understood that these wireless devices support cellular, wireless fidelity (Wi-Fi), Bluetooth, and/or near field communications on the same wireless device, and as such, pose extremely challenging filtering demands which can be handled by the BAW resonator of the present disclosure.

Modifications to embodiments of the present disclosure described in the foregoing are possible without departing from the scope of the present disclosure as defined by the accompanying claims. Expressions such as "including", "comprising", "incorporating", "have", "is" used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural. The word "exemplary" is used herein to mean "serving as an example, instance or illustration". Any embodiment described as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments and/or to exclude the incorporation of features from other embodiments. The word "optionally" is used herein to mean "is provided in some embodiments and not provided in other embodiments". It is appreciated that certain features of the present disclosure, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features of the invention, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination or as suitable in any other described embodiment of the disclosure.