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Title:
SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2018/139537
Kind Code:
A1
Abstract:
The present invention is a soluble material for three-dimensional molding that is used as a material of a support member that supports a three-dimensional object when the three-dimensional object is produced using a fused-deposition 3D printer, wherein said soluble material for three-dimensional molding comprises a hydrophilic-group-containing thermoplastic resin, and an organic salt compound represented by general formula (I). (R1 - SO3 -)nXn+ (I) According to the present invention, it is possible to minimize any reduction in accuracy of a three-dimensional object when the three-dimensional object is produced using a fused-deposition 3D printer, and it is possible to provide a soluble material for three-dimensional molding for use in a support member, said soluble material having a high rate of dissolution in neutral water and being capable of being quickly removed from a precursor of the three-dimensional object without the use of a strong alkali aqueous solution.

Inventors:
HIRAI,Jouji (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
YOSHIMURA,Tadanori (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
TSUBOI,Tomoya (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
SAWADA,Hiroki (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
Application Number:
JP2018/002287
Publication Date:
August 02, 2018
Filing Date:
January 25, 2018
Export Citation:
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Assignee:
KAO CORPORATION (14-10, Nihonbashi Kayabacho 1-chome Chuo-k, Tokyo 10, 〒1038210, JP)
International Classes:
B29C64/40; B29C64/118; B33Y10/00; B33Y70/00; C08K5/42; C08L101/00
Domestic Patent References:
WO2016125860A12016-08-11
WO2015182681A12015-12-03
WO2014051046A12014-04-03
Foreign References:
JP2008507619A2008-03-13
JP2008507619A2008-03-13
JP2002516346A2002-06-04
JP2016019789A2016-02-04
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (First Shin-Osaka MT Bldg. 2nd Floor, 5-13-9 Nishinakajima Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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