SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING

Title:

SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING

Document Type and Number:

WIPO Patent Application WO/2018/139537

Kind Code:

A1

Abstract:

The present invention is a soluble material for three-dimensional molding that is used as a material of a support member that supports a three-dimensional object when the three-dimensional object is produced using a fused-deposition 3D printer, wherein said soluble material for three-dimensional molding comprises a hydrophilic-group-containing thermoplastic resin, and an organic salt compound represented by general formula (I). (R1 - SO3 -)nXn+ (I) According to the present invention, it is possible to minimize any reduction in accuracy of a three-dimensional object when the three-dimensional object is produced using a fused-deposition 3D printer, and it is possible to provide a soluble material for three-dimensional molding for use in a support member, said soluble material having a high rate of dissolution in neutral water and being capable of being quickly removed from a precursor of the three-dimensional object without the use of a strong alkali aqueous solution.

Inventors:

HIRAI JOUJI (JP)
YOSHIMURA TADANORI (JP)
TSUBOI TOMOYA (JP)
SAWADA HIROKI (JP)

Application Number:

PCT/JP2018/002287

Publication Date:

August 02, 2018

Filing Date:

January 25, 2018

Export Citation:

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Assignee:

KAO CORP (JP)

International Classes:

B29C64/40; B29C64/118; B33Y10/00; B33Y70/00; C08K5/42; C08L101/00

Domestic Patent References:

WO2016125860A1	2016-08-11
WO2015182681A1	2015-12-03
WO2014051046A1	2014-04-03

Foreign References:

JP2008507619A	2008-03-13
JP2008507619A	2008-03-13
JP2002516346A	2002-06-04
JP2016019789A	2016-02-04

Other References: