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Patent Searching and Data


Title:
SOLVENT-BASED ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/230948
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solvent-based adhesive composition which has excellent storage stability and excellent contamination prevention of the environment after application. A solvent-based adhesive composition according to the present invention, which contains (A) a resin, (B) an organic solvent and (C) a pigment that has a specific gravity of 3 or less, has excellent storage stability and excellent contamination prevention of the environment after application. It is preferable that the content of the component (C) is 0.05-10 parts by weight relative to 100 parts by weight of the total of the component (A) and the component (B).

Inventors:
MIZUKAMI MASAYUKI (JP)
Application Number:
PCT/JP2019/021713
Publication Date:
December 05, 2019
Filing Date:
May 31, 2019
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J11/06; C09J127/06
Foreign References:
JPH10298519A1998-11-10
JP2008308646A2008-12-25
JP2017101201A2017-06-08
JP2008274145A2008-11-13
JPH0386747A1991-04-11
JP2016117813A2016-06-30
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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