Title:
SOLVENT COMPOSITION FOR CONDUCTIVE PASTE, VEHICLE, AND CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2020/071198
Kind Code:
A1
Abstract:
Provided are a solvent composition for conductive paste, a vehicle using the same, and a conductive paste that do not give rise to interlayer delamination caused by the phenomenon of sheet attack, dry readily via evaporation, and have suitable viscosity properties, and that are for manufacturing multi-layer ceramic components which do not exhibit electrical property deterioration. The solvent composition for conductive paste contains (A) a monoterpene alcohol and/or a monoterpene fatty acid ester, and (B) a lactic acid alkyl ester.
Inventors:
HONDA ERI (JP)
TAKATA SHIGETO (JP)
MICHIDA MINORU (JP)
TAKATA SHIGETO (JP)
MICHIDA MINORU (JP)
Application Number:
PCT/JP2019/037508
Publication Date:
April 09, 2020
Filing Date:
September 25, 2019
Export Citation:
Assignee:
YASUHARA CHEMICAL CO LTD (JP)
International Classes:
H01B1/20; C09D11/52; H05K1/09
Domestic Patent References:
| WO2018168004A1 | 2018-09-20 |
Foreign References:
| JP2014047413A | 2014-03-17 | |||
| JP2010135180A | 2010-06-17 | |||
| JP2015193705A | 2015-11-05 | |||
| JP2010132736A | 2010-06-17 |
Attorney, Agent or Firm:
SHIRAI Shigetaka (JP)
Download PDF: