Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SOLVENT COMPOSITION FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/125618
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a solvent composition, for use in ink for forming wiring and electrodes in an electronic device by a printing method, the solvent composition making it possible: to improve ink printing precision; to perform calcining at low temperatures; and to keep the quantity of ash produced after calcining to an extremely low level. This solvent composition for manufacturing an electronic device is used in ink for manufacturing an electronic device by a printing method, and comprises a solvent and a compound represented by formula (1). In the formula, R represents an aliphatic hydrocarbon group with a carbon number of at least 1. The four R's in the formula are all the same group, or are two different groups.

Inventors:
SUZUKI, Youji (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
SAKANISHI, Yuichi (2-1-4 Higashisakae, Ohtake-sh, Hiroshima 95, 〒7390695, JP)
AKAI, Yasuyuki (1239 Shinzaike, Aboshi-ku, Himeji-sh, Hyogo 83, 〒6711283, JP)
Application Number:
JP2016/052068
Publication Date:
August 11, 2016
Filing Date:
January 26, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAICEL CORPORATION (3-1 Ofuka-cho, Kita-ku Osaka-sh, Osaka 11, 〒5300011, JP)
International Classes:
H01G4/232; C09D11/033; H01G4/30; H05K1/09
Foreign References:
JP2009155592A2009-07-16
JPH08162358A1996-06-21
JP2005197079A2005-07-21
JP2013149457A2013-08-01
Attorney, Agent or Firm:
GOTO & CO. (2-18, Kobai-cho Kita-ku, Osaka-sh, Osaka 38, 〒5300038, JP)
Download PDF: