Title:
SOLVENT COMPOSITION AND METHOD FOR PRODUCING SINTERED OBJECT
Document Type and Number:
WIPO Patent Application WO/2024/095698
Kind Code:
A1
Abstract:
Provided is a solvent composition which need not be removed after having been applied and which facilitates the production of a sintered object excellent in terms of electrical conductivity and bondability. The solvent composition of the present disclosure is a solvent composition for sintering aids which contains a reducing organic substance and a basic compound. This solvent composition of the present disclosure may be a solvent composition which contains the reducing organic substance, the basic compound, and a coordinating organic compound that is not the basic compound, wherein the coordinating organic compound has a higher boiling point than the reducing organic substance.
Inventors:
KOBATAKE TAKANORI (JP)
HAGA MOTOHARU (JP)
HAGA MOTOHARU (JP)
Application Number:
PCT/JP2023/036559
Publication Date:
May 10, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
B22F3/10; B22F1/054; B22F1/102; B22F7/08; C21D1/70
Domestic Patent References:
| WO2021166627A1 | 2021-08-26 | |||
| WO2022030327A1 | 2022-02-10 |
Foreign References:
| JP2014036125A | 2014-02-24 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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