Title:
SOLVENT-FREE LIGHT-CURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/194920
Kind Code:
A1
Abstract:
A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent.
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Inventors:
MAEDA DAISUKE (JP)
NISHIMURA NAOYA (JP)
NISHIMURA NAOYA (JP)
Application Number:
PCT/JP2016/066098
Publication Date:
December 08, 2016
Filing Date:
June 01, 2016
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C09J179/04; C09J4/00; C09J4/02; C09J7/10; C09J7/30; C09J11/06
Domestic Patent References:
| WO2013168787A1 | 2013-11-14 |
Foreign References:
| JP2015091919A | 2015-05-14 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Patent business corporation Hideaki international patent firm (JP)
Patent business corporation Hideaki international patent firm (JP)
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