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Patent Searching and Data


Title:
SOLVENT-FREE REACTIVE ADHESIVE AGENT, CURED PRODUCT THEREOF, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/107881
Kind Code:
A1
Abstract:
The present invention provides a non-solvent reactive adhesive agent which has outstanding coating strength and softness even after a heat resistance test and an oil resistance test, and suffers no effects on fracture elongation even when the mixture ratio of a main agent and a curing agent has changed. The above problem is solved by a solvent-free reactive adhesive agent, containing a polyisocyanate containing the trimethylolpropane adduct of at least either tolylene diisocyanate or diphenylmethane diisocyanate and aromatic polyisocyanate not including a trimethylolpropane adduct, and a polyol, and containing a total of the trimethylolpropane adduct of tolylene diisocyanate and the trimethylolpropane adduct of the diphenylmethane diisocyanate in the range of 40-80 wt. % based on the total weight of the polyisocyanate.

Inventors:
TSU TAKAYUKI (JP)
OYA TORU (JP)
Application Number:
PCT/JP2021/042602
Publication Date:
May 27, 2022
Filing Date:
November 19, 2021
Export Citation:
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Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
C09J175/04; C08G18/10; C08G18/32; C08G18/44; C08G18/72; C08G18/76; C09J175/06
Domestic Patent References:
WO2017170486A12017-10-05
WO2019124511A12019-06-27
Foreign References:
JP2016098323A2016-05-30
JP2002155260A2002-05-28
JP2006057089A2006-03-02
JP2012144655A2012-08-02
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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