Title:
SOLVENT-FREE SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/110576
Kind Code:
A1
Abstract:
A solvent-free silicone-modified polyimide resin composition having fluidity and including no solvent, the composition containing (A) a silicone-modified polyimide resin of formula (1), Ee-Ff-Gg (1) (E is formula (2), F is formula (3), and G is a diamine-derived divalent residue; f+e+g= 100 mol%, the molar ratio of f/(e+g) is 0.8-1.2) (2) (RA is a divalent hydrocarbon group, R1-R4 are monovalent hydrocarbon groups, R5 and R6 are an alkyl group, aryl group, or aralkyl group; m, n, and o are 0-20, n+o≧1, m+n+o=1-60) -Im-X-Im- (3) (Im is a cyclic group including a cyclic imide structure, X is a single bond, oxygen, sulfur, sulfide group, sulfone group, carbonyl group, -NRN-, -CRB
2-, RAr
h-, -ＲAr
h(ＯＲAr)i-, alkylene group, trivalent group having one H eliminated from said group, or arylene-alkylene group), (B) a polymerizable compound, (C) a polymerization initiator, and (D) hydrophobic fumed silica. This composition has excellent handleability due to its fluidity and thixotropy.
Inventors:
HATTORI HATSUHIKO (JP)
YONEDA YOSHINORI (JP)
YONEDA YOSHINORI (JP)
Application Number:
PCT/JP2016/087012
Publication Date:
June 29, 2017
Filing Date:
December 13, 2016
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08F2/44; C09J179/08
Domestic Patent References:
| WO2015077161A1 | 2015-05-28 |
Foreign References:
| JP2006104447A | 2006-04-20 | |||
| JP2009029843A | 2009-02-12 | |||
| JP2012119599A | 2012-06-21 | |||
| JP2006269250A | 2006-10-05 | |||
| JP2007014637A | 2007-01-25 | |||
| US20150290116A1 | 2015-10-15 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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