Title:
SOLVENT-TYPE REMOVABLE ADHESIVE COMPOSITION AND REMOVABLE ADHESIVE PRODUCT
Document Type and Number:
WIPO Patent Application WO/2008/035709
Kind Code:
A1
Abstract:
Disclosed is a solvent-type removable adhesive composition which comprises
a high-Tg polymer (A) having a glass transition temperature (Tg) of 0˚C
or higher, a low-Tg polymer (B) having a Tg lower than that of the high-Tg polymer
and also having a pressure-sensitive adhesion property, and a solvent. In an
adhesive layer produced by using the adhesive composition, the high-Tg polymer
(A) and the low-Tg polymer (B) are not dissolved in each other and form a sea-island
structure, wherein the high-Tg polymer (A) forms an island phase and the low-Tg
polymer (B) forms a sea phase. The composition enables to form an adhesive layer
having an excellent high-speed peeling property when used as a surface protection
film for an optical film.
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Inventors:
SAITO MASAHIKO (JP)
OKA SHIGERU (JP)
OKA SHIGERU (JP)
Application Number:
PCT/JP2007/068181
Publication Date:
March 27, 2008
Filing Date:
September 19, 2007
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
SAITO MASAHIKO (JP)
OKA SHIGERU (JP)
SAITO MASAHIKO (JP)
OKA SHIGERU (JP)
International Classes:
C09J7/38; C09J201/00
Foreign References:
| JP2005146151A | 2005-06-09 | |||
| JP2006124691A | 2006-05-18 | |||
| JP2003277709A | 2003-10-02 | |||
| JPH0111670A | ||||
| JP2001011396A | 2001-01-16 | |||
| JPH0115960A |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (1-16 Dojima 2-chome, Kita-ku, Osaka-sh, Osaka 03, JP)
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