Title:
SOLVENTLESS, MOISTURE−CURABLE HOT−MELT URETHANE RESIN COMPOSITION, FOAMED PRODUCT AND SHEET STRUCTURE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/042271
Kind Code:
A1
Abstract:
A solventless, moisture−curable hot−melt urethane resin composition, characterized in that it comprises a hot−melt urethane prepolymer containing an isocyanate group (A), a compound at least two active hydrogen atoms (B) and water (C), wherein the ratio of the equivalents of the isocyanate group in the prepolymer (A) and the total equivalents of reactive groups in a compound at least two active hydrogen atoms (B) and water (C) [equivalents of NCO group (A)&sol total equivalents of reactive groups in (B&plus C)] is in the range of 1.5 to 20.0.
Inventors:
Kanagawa, Yoshinori (10-38-301, Sugawara-cho Izumiotsu-shi, Osaka, 595-0066, JP)
Niwa, Toshio (1-24-5, Wakamiya-cho Izumiotsu-shi, Osaka, 595-0065, JP)
Takahashi, Masahiko (29-5-203, Yamadaminami Suita-shi, Osaka, 565-0823, JP)
Niwa, Toshio (1-24-5, Wakamiya-cho Izumiotsu-shi, Osaka, 595-0065, JP)
Takahashi, Masahiko (29-5-203, Yamadaminami Suita-shi, Osaka, 565-0823, JP)
Application Number:
PCT/JP2002/006009
Publication Date:
May 22, 2003
Filing Date:
June 17, 2002
Export Citation:
Assignee:
DAINIPPON INK AND CHEMICALS, INC. (35-58, Sakashita 3-chome Itabashi-ku, Tokyo, 174-8520, JP)
Kanagawa, Yoshinori (10-38-301, Sugawara-cho Izumiotsu-shi, Osaka, 595-0066, JP)
Niwa, Toshio (1-24-5, Wakamiya-cho Izumiotsu-shi, Osaka, 595-0065, JP)
Takahashi, Masahiko (29-5-203, Yamadaminami Suita-shi, Osaka, 565-0823, JP)
Kanagawa, Yoshinori (10-38-301, Sugawara-cho Izumiotsu-shi, Osaka, 595-0066, JP)
Niwa, Toshio (1-24-5, Wakamiya-cho Izumiotsu-shi, Osaka, 595-0065, JP)
Takahashi, Masahiko (29-5-203, Yamadaminami Suita-shi, Osaka, 565-0823, JP)
International Classes:
B29C41/00; C08G18/10; (IPC1-7): C08G18/10; C09J175/04; B29C41/12
Attorney, Agent or Firm:
Shiga, Masatake (Shiga International Patent Office, 2-3-1 Yaesu Chuo-ku, Tokyo, 104-8453, JP)