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Patent Searching and Data


Title:
SOUND-ABSORBING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/213140
Kind Code:
A1
Abstract:
The present disclosure pertains to a sound-absorbing material comprising, in the following order: a first substrate layer having communication holes; an adhesive layer; and a second substrate layer having communication holes.

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Inventors:
TAKAYASU SATOSHI (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
JP2019/016688
Publication Date:
October 22, 2020
Filing Date:
April 18, 2019
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G10K11/16; B32B5/22; E04B1/86; G10K11/168
Foreign References:
JPH11242486A1999-09-07
JP2004130731A2004-04-30
JP2018169555A2018-11-01
JP2012024955A2012-02-09
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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