Title:
SOUND ABSORBING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/213685
Kind Code:
A1
Abstract:
The present disclosure pertains to a sound absorbing material comprising, in the following order: a first substrate layer having a communication hole; an adhesive layer; and a second substrate layer having a communication hole.
Inventors:
TAKAYASU SATOSHI (JP)
YOKOKURA AI (JP)
KOTAKE TOMOHIKO (JP)
YOKOKURA AI (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
PCT/JP2020/016745
Publication Date:
October 22, 2020
Filing Date:
April 16, 2020
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G10K11/168
Foreign References:
| JPH11242486A | 1999-09-07 | |||
| JP2004130731A | 2004-04-30 | |||
| JP2018169555A | 2018-11-01 | |||
| JP2012024955A | 2012-02-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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